公开(公告)号：DE4427309C2

公开(公告)日：1999-12-02

申请号：DE4427309

申请日：1994-08-02

Applicant: IBM

Inventor： DRUSCHKE FRANK ,  DIEMER ROLAND ,  ELSNER GERHARD ,  SCHMID WOLFGANG ,  BRAUN REINHOLD ,  GRUBER HARALD ,  BECK WOLFGANG ,  KRATZERT RAINER

IPC: G06K19/077 ,  H01L23/29 ,  H01L21/50 ,  H01L23/04 ,  B29C45/14

Abstract: PCT No. PCT/EP95/02150 Sec. 371 Date Jan. 31, 1997 Sec. 102(e) Date Jan. 31, 1997 PCT Filed Jun. 6, 1995 PCT Pub. No. WO96/04611 PCT Pub. Date Feb. 15, 1996Described is a method for manufacturing of carrier element modules of a thin carrier element (4) and a thereon mounted semiconductor chip (2). This method renders possible the application of chips (2) with great dimensions (macro-chips) and a wide variety of different types. A chip transfer moulding process is designed so that a minimised height-without the need for reworking-is achievable, and therefore a less costly surface mounting of the chips can be applied. The manufactured module according to the invention can be used as well as in flexible circuit boards (e.g. for cameras) or in chipcards. The method according to the present invention has a first step of putting the at least one IC (2) onto the carrier element (4), a second step of contacting the at least one IC (2) with the carrier element (4) and a third step of transfer moulding a transfer moulding compound (18) to encapsulate the IC (2).