公开(公告)号：DE4427309C2

公开(公告)日：1999-12-02

申请号：DE4427309

申请日：1994-08-02

Applicant: IBM

Inventor： DRUSCHKE FRANK ,  DIEMER ROLAND ,  ELSNER GERHARD ,  SCHMID WOLFGANG ,  BRAUN REINHOLD ,  GRUBER HARALD ,  BECK WOLFGANG ,  KRATZERT RAINER

IPC: G06K19/077 ,  H01L23/29 ,  H01L21/50 ,  H01L23/04 ,  B29C45/14

Abstract: PCT No. PCT/EP95/02150 Sec. 371 Date Jan. 31, 1997 Sec. 102(e) Date Jan. 31, 1997 PCT Filed Jun. 6, 1995 PCT Pub. No. WO96/04611 PCT Pub. Date Feb. 15, 1996Described is a method for manufacturing of carrier element modules of a thin carrier element (4) and a thereon mounted semiconductor chip (2). This method renders possible the application of chips (2) with great dimensions (macro-chips) and a wide variety of different types. A chip transfer moulding process is designed so that a minimised height-without the need for reworking-is achievable, and therefore a less costly surface mounting of the chips can be applied. The manufactured module according to the invention can be used as well as in flexible circuit boards (e.g. for cameras) or in chipcards. The method according to the present invention has a first step of putting the at least one IC (2) onto the carrier element (4), a second step of contacting the at least one IC (2) with the carrier element (4) and a third step of transfer moulding a transfer moulding compound (18) to encapsulate the IC (2).

公开(公告)号：DE4427309A1

公开(公告)日：1996-02-15

申请号：DE4427309

申请日：1994-08-02

Applicant: IBM

Inventor： DRUSCHKE FRANK DIPL CHEM DR ,  DIEMER ROLAND ,  ELSNER GERHARD DIPL PHYS DR ,  SCHMID WOLFGANG ,  BRAUN REINHOLD DIPL ING ,  GRUBER HARALD ,  BECK WOLFGANG ,  KRATZERT RAINER DIPL ING

IPC: G06K19/077 ,  H01L23/29 ,  H01L21/50 ,  H01L21/56 ,  H05K1/02 ,  B29C45/14

Abstract: A process is disclosed for producing an IC-module that consists of a thin support element (4) upon which is mounted a semiconductor chip (2). This process also allows the use of IC-components (2) of especially large sizes (macrochips) and various types. The chip is injection moulded so that it has a minimum height without requiring further processing and may be economically surface-mounted. The module may be used both in flexible printed circuit cards (for example in photographic cameras) and in smart cards. In a first step of the process, at least one IC-component (2) is applied on the support element (4), in a second step the IC-component (2) is contacted with the support element (4) and in a third step an injection moulding material (18) is injection moulded around the IC-component (2) so as to envelop it.

公开(公告)号：DE4424396C2

公开(公告)日：1996-12-12

申请号：DE4424396

申请日：1994-07-11

Applicant: IBM

Inventor： DRUSCHKE FRANK DIPL CHEM DR ,  KRATZERT RAINER DIPL ING ,  GRUBER HARALD ,  BECK WOLFGANG ,  DIEMER ROLAND ,  SCHMID WOLFGANG ,  BRAUN REINHOLD DIPL ING ,  ELSNER GERHARD DIPL PHYS DR

IPC: G06K19/077 ,  B42D15/10 ,  G11C5/00 ,  H01L21/60 ,  H01L23/50 ,  H05K1/18 ,  H05K3/32

公开(公告)号：DE4424396A1

公开(公告)日：1996-01-18

申请号：DE4424396

申请日：1994-07-11

Applicant: IBM

Inventor： DRUSCHKE FRANK DIPL CHEM DR ,  KRATZERT RAINER DIPL ING ,  GRUBER HARALD ,  BECK WOLFGANG ,  DIEMER ROLAND ,  SCHMID WOLFGANG ,  BRAUN REINHOLD DIPL ING ,  ELSNER GERHARD DIPL PHYS DR

IPC: G06K19/077 ,  B42D15/10 ,  G11C5/00 ,  H01L21/60 ,  H01L23/50 ,  H05K1/18 ,  H05K3/32

Abstract: The proposal is the use of the prior art C4 technique to produce an electrical connection between an IC unit (2) and a substrate component (4) designed for inclusion in chip cards or other data medium boards. This results in facilities for contact between the IC unit (2) and the substrate component (4) permitting a high degree of integration of the IC unit (2) and a correspondingly large number of contacts between the IC unit (2) and its environment, makes contact possible over the entire surface of the IC unit (2) and, for the same requirements for contact between the IC unit (2) and the substrate (4), lower structural heights of the connection between said IC unit (2) and the substrate (4).