公开(公告)号：GB2524517A

公开(公告)日：2015-09-30

申请号：GB201405316

申请日：2014-03-25

Applicant: IBM

Inventor： KUNIGKEIT ECKHARD ,  TRIANNI QUINTINO LORENZO ,  KUCZERA GABRIELE

IPC: G01R1/073

Abstract: A probe card 110 connects several die on a wafer 104 to automated test equipment (ATE) via a probe card holder 107. Spacer supports 109 are fixed between probe card and holder, with an additional rigid backing plate 106 attached to the probe card. Levelling actuators 111 are used until the backing plate connects with the holder at a single point, when linear actuators 108 hold the plate in secure connection so all reference contacts 112 are sufficiently electrically connected to the wafer. The actuators are located in either the probe card holder or probe card backing plate. Measurement unit 103 provides information about the parallel levelling of wafer and probe card, using for example optical imaging, confocal microscope, mechanical measurement or ultrasonic sensor.

公开(公告)号：GB2511087A

公开(公告)日：2014-08-27

申请号：GB201303177

申请日：2013-02-22

Applicant: IBM

Inventor： KUNIGKEIT ECKHARD ,  ECKERT MARTIN ,  TRIANNI QUINTINO LORENZO ,  TORREITER OTTO ANDREAS

IPC: H01L21/66

Abstract: A method for electrical testing of a 3D integrated circuit chip stack is described. The 3D integrated circuit chip stack comprises at least a first integrated circuit chip (300) and a second integrated circuit chip (400). The first integrated circuit chip (300) and the second integrated circuit chip (400) are not soldered together for performing electrical testing. The testing improves yield by allowing defective chips to be found prior to soldering of the chip to the IC chip stack. The assembly for holding the IC chips during testing comprises holes 220 in its sidewalls which allow a vacuum to be formed between the chips, creating a mechanical connection between the chips.