公开(公告)号：JPH04224824A

公开(公告)日：1992-08-14

申请号：JP5566691

申请日：1991-02-28

Applicant: IBM

Inventor： KURISHIYUNA GANDEII SAKUDEBU ,  JIYON PATORITSUKU HAMERU ,  RANII WAIIRIN KUUON ,  ROBAATO NIIRU RANGU ,  RIIOU RORENSU RAINHAN ,  HAABANZU SHINGU SAKUDEBU

IPC: C08G73/10 ,  C08L79/08 ,  H01L21/312 ,  H01L23/29 ,  H01L23/498 ,  H01L23/532 ,  H05K1/00

公开(公告)号：JPH03204649A

公开(公告)日：1991-09-06

申请号：JP32135990

申请日：1990-11-27

Applicant: IBM

Inventor： RANII WAIIRIN KUUON ,  HAABANZU SHINGU SAKUDEBU ,  KURISHIYUNA GANDEII SAKUDEBU

IPC: C08F2/46 ,  C08G73/10 ,  C08K5/23 ,  C08K5/28 ,  C08L79/08 ,  G03F7/038 ,  G03F7/039 ,  G03F7/075 ,  G03F7/26 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE: To attain thermal stabilization by using a specified bis-(3-amino-4- hydroxyphenyl) compd., a diacid anhydride such as specified bis-(3,4- dicarboxyphenyl) anhydride or aliphatic tetracarboxylic acid anhydride and a photoactive compd. CONSTITUTION: This photosensitive polyimide compsn. consists of bis-(3-amino-4- hydroxyphenyl) compd. represented by formula I, a diacid anhydride such as bis-(3,4-dicarboxyphenyl) anhydride represented by formula II or aliphatic tetracarboxylic acid anhydride and a photoactive compd. such as bisazide. In the formula I, Q is -O-, -S-, etc. In the formula II, Z is -O-, -S-, -O-Ar-S-Ar-O, etc. Thermal stabilization is attained.

公开(公告)号：JPS61255898A

公开(公告)日：1986-11-13

申请号：JP6884286

申请日：1986-03-28

Applicant: IBM

Inventor： KIISU SAMIYUERU PENINGUTON ,  MITSUCHIERU SHIMONZU KOOEN ,  KURISHIYUNA GANDEII SAKUDEBU

IPC: B41C1/10 ,  B41J2/325 ,  B41N1/00 ,  B41N1/10