公开(公告)号：US3873330A

公开(公告)日：1975-03-25

申请号：US41734773

申请日：1973-11-19

Applicant: IBM

Inventor： SHERK THOMAS A ,  TUMMALA RAO R

IPC: C03C3/074 ,  C03C8/10 ,  C03C8/24 ,  C03C27/00 ,  C03C3/10 ,  C03C3/12 ,  C03C3/30

CPC classification number: C03C3/0745 ,  C03C8/245 ,  C03C27/00

Abstract: Sealing glass which may be used for sealing glass plates together at relatively low temperatures. The glass has a softening temperature of about 412*C and has a thermal coefficient of expansion (from room temperature to 300*C) of about 84 X 10 7 per *C. The glass consists substantially of the following constituents in the following proportions: Percent by weight PbO 66.0 B2O3 14.0 ZnO 10.5 SiO2 2.0 CuO 2.5 Bi2O3 1.5 Al2O3 3.

Abstract translation: 密封玻璃可用于在相对较低的温度下将玻璃板密封在一起。 该玻璃的软化温度为约412℃，并且具有约84×10 -7 /℃的热膨胀系数（从室温至300℃）。玻璃基本上由以下组分组成 以下比例：

公开(公告)号：US3640738A

公开(公告)日：1972-02-08

申请号：US3640738D

申请日：1970-11-20

Applicant: IBM

Inventor： DETWEILER JOHN R JR ,  TUMMALA RAO R

IPC: C03C3/093 ,  C03C3/04

CPC classification number: C03C3/093

Abstract: A glass composition particularly adapted for use with ceramic materials in electronic module applications having a thermal coefficient of expansion substantially matching the thermal coefficient of expansion of ceramic material, and a low dielectric constant less than 4.5. The composition is a borosilicate glass consisting essentially of SiO2, B2O3, CaO, A12O3, Na2O, K2O, BaO, ZrO2, and MgO in relatively precise amounts.

Abstract translation: 特别适用于具有基本上与陶瓷材料的热膨胀系数匹配的热膨胀系数和小于4.5的低介电常数的电子模块应用中的陶瓷材料的玻璃组合物。 该组合物是基本上由相对精确量的SiO 2，B 2 O 3，CaO，Al 2 O 3，Na 2 O，K 2 O，BaO，ZrO 2和MgO组成的硼硅酸盐玻璃。

公开(公告)号：US3928051A

公开(公告)日：1975-12-23

申请号：US42237873

申请日：1973-12-06

Applicant: IBM

Inventor： BROWNLOW JAMES M ,  BUCHANAN RELVA C ,  TUMMALA RAO R

IPC: H01J11/02 ,  C03C3/072 ,  C03C4/16 ,  H01B3/08 ,  C03C3/10 ,  C03C3/04 ,  C03C5/02

CPC classification number: H01B3/087 ,  C03C3/072 ,  C03C4/16

Abstract: A family of dielectric glasses having properties such that, when heat is applied to seal the dielectric glasses, there is no crazing in a MgO overcoat. These dielectric glasses have such viscosity properties as not to craze a MgO overcoat at a temperature of about 480*C corresponding approximately to log viscosity of 10.3 poises and yet fire into good dielectric films at about 610*C. The glass has substantially the following constitutents:

Abstract translation: 一种电介质玻璃系列，其特征在于，当施加热量以密封电介质玻璃时，在MgO外涂层中不会发生龟裂。 这些电介质玻璃具有这样的粘度特性，即在约480℃的温度下不会使MgO外涂层变热，对应于大约对数粘度为10.3泊，然后在约610℃下进入良好的介电膜。玻璃具有基本上以下的组成 ：}重量％} PbO 55.0-57.0} SiO2 12.0-14.0} B2O3 21.0-22.0} Al2O3 1.0-4.0} MgO 1.5-2.2} CaO 2.0-5.5} Na2O 1.8-2。

公开(公告)号：US3923530A

公开(公告)日：1975-12-02

申请号：US37418973

申请日：1973-06-27

Applicant: IBM

Inventor： SHERK THOMAS A ,  TUMMALA RAO R

IPC: H01J11/02 ,  C03C3/072 ,  C03C3/091 ,  C03C4/16 ,  C03C8/10 ,  H01B3/08 ,  C03C3/10 ,  C03C3/04 ,  C03C3/30

CPC classification number: H01B3/087 ,  C03C3/072 ,  C03C3/091 ,  C03C4/16

Abstract: A family of dielectric glasses having properties such that, when heat is applied to seal the dielectric glasses, there is no crazing in a MgO overcoat. These dielectric glasses have such viscosity properties as not to craze a MgO overcoat in the range 455 to 505*C corresponding to log viscosity of 10.3 poises and yet fire into good dielectric films at about 600*C. The glass has substantially the following constituents:

D R A W I N G

Abstract translation: 一种电介质玻璃系列，其特征在于，当施加热量以密封电介质玻璃时，在MgO外涂层中不会发生龟裂。 这些电介质玻璃具有这样的粘度特性，即不使MgO外涂层在455至505℃的范围内对应于对数粘度为10.3泊，并在约600℃下被引入良好的介电膜中。玻璃具有基本上以下组成： }重量％} PbO 62.4 - 69.6} SiO2 5.8 - 13.6} B2O3 13.6 - 20} Al2O3 0.2 - 1.0} MgO 0-5} CaO 0-6}

公开(公告)号：US3904426A

公开(公告)日：1975-09-09

申请号：US49501474

申请日：1974-08-05

Applicant: IBM

Inventor： FRIESER RUDOLF G ,  POWELL JIMMIE L ,  TUMMALA RAO R

IPC: C03B5/00 ,  C03C3/074 ,  C03C8/10 ,  C03C8/24 ,  C03C3/10

CPC classification number: C03C8/245 ,  C03C3/0745

Abstract: A process for manufacturing a sealing glass composition consisting essentially of the following ingredients in the following proportions:

The process comprises the steps of providing the batch of ingredients to the above proportions and insuring a full mixture or mixing of the same. Thereafter, in one embodiment of the process, the batch may be heated to between 750 and 850*C to form a liquid melt and then the liquid melt is further heated until the temperature is 1,100 + OR - 20*C. The temperature of the melt is held between the aforementioned limits for a period of at least 3 hours and no longer than 3 1/2 hours, and thereafter the temperature of the melt is lowered to effectively inhibit bubbling of the liquid melt, and then the melt is removed for further processing.

Abstract translation: 一种密封玻璃组合物的制造方法，主要由下列成分组成：}重量％} PbO 66.0} B2O3 14.0} SiO2 2.0} Al2O3 3.5} ZnO 10.5} CuO 2.5} Bi2O3 1。

公开(公告)号：CA1007052A

公开(公告)日：1977-03-22

申请号：CA159876

申请日：1972-12-27

Applicant: IBM

Inventor： LANGSTON PERRY R JR ,  TUMMALA RAO R ,  WILSON DONALD M

IPC: G02F1/1339 ,  G09F9/307 ,  H01J9/26

公开(公告)号：DE2534396A1

公开(公告)日：1976-02-19

申请号：DE2534396

申请日：1975-08-01

Applicant: IBM

Inventor： FRIESER RUDOLF G ,  POWELL JIMMIE L ,  TUMMALA RAO R

IPC: C03B5/00 ,  C03C3/074 ,  C03C8/10 ,  C03C8/24 ,  C03C3/30 ,  C03C3/10

Abstract: A process for manufacturing a sealing glass composition consisting essentially of the following ingredients in the following proportions: } Percent by weight }PbO 66.0 }B2O3 14.0 }SiO2 2.0 }Al2O3 3.5 }ZnO 10.5 }CuO 2.5 }Bi2O3 1.

公开(公告)号：CH605439A5

公开(公告)日：1978-09-29

申请号：CH772374

申请日：1974-06-06

Applicant: IBM

Inventor： SHERK THOMAS A ,  TUMMALA RAO R

IPC: H01J11/02 ,  C03C3/072 ,  C03C3/091 ,  C03C4/16 ,  C03C8/10 ,  H01B3/08 ,  C03C3/30 ,  C03C3/10 ,  G09F9/00

Abstract: A family of dielectric glasses having properties such that, when heat is applied to seal the dielectric glasses, there is no crazing in a MgO overcoat. These dielectric glasses have such viscosity properties as not to craze a MgO overcoat in the range 455 to 505 DEG C corresponding to log viscosity of 10.3 poises and yet fire into good dielectric films at about 600 DEG C. The glass has substantially the following constituents: }% by weight }PbO 62.4 - 69.6 }SiO2 5.8 - 13.6 }B2O3 13.6 - 20 }Al2O3 0.2 - 1.0 }MgO 0 - 5 }CaO 0 - 6 }

公开(公告)号：CA978253A

公开(公告)日：1975-11-18

申请号：CA171097

申请日：1973-05-02

Applicant: IBM

Inventor： FOSTER BETTY J ,  TUMMALA RAO R

IPC: H01J11/00 ,  C03C3/072 ,  C03C8/10 ,  C03C17/04 ,  C03C17/36 ,  C03C27/10 ,  H01J9/24 ,  H01J9/26

Abstract: A method of making a gaseous discharge display and/or memory device in which no separate passivation step is required to protect the electrical conductors formed on a glass substrate. After a dielectric glass frit slurry is sprayed over the conductors and dried, the assemblage is fired in an oven to cause the dielectric to reflow and, when later cooled, to provide a smooth protective dielectric layer over the conductors. Applicants found that firing in a very wet atmosphere with neutral or oxidizing ambients causes the dielectric to reflow at a substantially lower temperature than it would in a similar but dry atmosphere. This desirably permits dielectrics of higher viscosity and consequently higher softening temperatures to now be used because the requisite firing temperature is reduced in the wet atmosphere. High viscosity dielectrics are preferred to minimize crazing of the magnisium oxide coating that is currently placed over the dielectric coating after the dielectric-substrate is cooled. Except for this reduction in firing temperature, these high viscosity dielectrics would have to be fired at temperatures over 600 DEG C., which undesirably causes warping of the soda-lime silica glass substrates currently available.

公开(公告)号：CA1043822A

公开(公告)日：1978-12-05

申请号：CA232197

申请日：1975-07-24

Applicant: IBM

Inventor： FRIESER RUDOLF G ,  POWELL JIMMIE L ,  TUMMALA RAO R

IPC: C03B5/00 ,  C03C3/074 ,  C03C8/10 ,  C03C8/24 ,  C03C3/10

Abstract: A PROCESS FOR MANUFACTURING LOW TEMPERATURE SEALING GLASSES A process for manufacturing a sealing glass composition consisting essentially of the following ingredients in the following proportions: The process comprises the steps of providing the batch of ingredients to the above proportions and insuring a full mixture or mixing of the same. Thereafter, in one embodiment of the process, the batch may be heated to between 750 and 850.degree.C to form a liquid melt and then the liquid melt is further heated until the temperature is 1100? 20.degree.C. The temperature of the melt is heldbetween the aforementioned limits for a period of at least 3 hours and no longer than 3 1/2 hours, and thereafter the temperature of the melt is lowered to effectively inhibit bubbling of the liquid melt, and then the melt is removed for further processing.