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公开(公告)号:JPS61255523A
公开(公告)日:1986-11-13
申请号:JP7684986
申请日:1986-04-04
Applicant: IBM
Inventor: JONES JR ROBERT E , LEE RODNEY E , YEH TSU-HSING
IPC: G11B5/31
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公开(公告)号:DE69528349D1
公开(公告)日:2002-10-31
申请号:DE69528349
申请日:1995-12-12
Applicant: IBM
Inventor: HU HUNG-LIANG , LEE RODNEY E , SANTINI HUGO A E , TSANG CHING H
Abstract: A combined sunken magnetoresistive (MR) read/write head (30B) is provided wherein at least one (S1) of the first and second shield layers (S1,S2) are eliminated or thinned down in an insulation stack region just behind a pole tip region. This provides a depression behind the pole tip region where head components, such as the write coil, insulation stack and pole pieces of a write head, are located. In preferred embodiments, leads for an MR sensor of the head extend parallel to an air bearing surface (ABS) where they connect to first and second conductors beyond the limits of the shield layers. The conductors extend back into the head normal to the air bearing surface without any danger of shorting to the shield layers.
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公开(公告)号:CA1241111A
公开(公告)日:1988-08-23
申请号:CA503759
申请日:1986-03-11
Applicant: IBM
Inventor: JONES ROBERT E JR , LEE RODNEY E , YEH TSU-HSING
Abstract: SA984-022 A thin film magnetic transducer having a magnetic circuit having nickel-iron layers which encloses a portion of first and second windings. The portions of each winding traversing the nickel-iron layers have conductor segments equal in number and separated from each other in parallel planes. The conductor segments of each winding have a center-to-center spacing different from the remaining winding selected to avoid contact with the transition regions of the nickel-iron layers and which results in a common inductance for each winding. The windings are joined at one end to form a center tapped winding.
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公开(公告)号:DE69528349T2
公开(公告)日:2003-05-15
申请号:DE69528349
申请日:1995-12-12
Applicant: IBM
Inventor: HU HUNG-LIANG , LEE RODNEY E , SANTINI HUGO A E , TSANG CHING H
Abstract: A combined sunken magnetoresistive (MR) read/write head (30B) is provided wherein at least one (S1) of the first and second shield layers (S1,S2) are eliminated or thinned down in an insulation stack region just behind a pole tip region. This provides a depression behind the pole tip region where head components, such as the write coil, insulation stack and pole pieces of a write head, are located. In preferred embodiments, leads for an MR sensor of the head extend parallel to an air bearing surface (ABS) where they connect to first and second conductors beyond the limits of the shield layers. The conductors extend back into the head normal to the air bearing surface without any danger of shorting to the shield layers.
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