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1.发明公开A method of metallising an organic substrate so as to achieve improved adhesion of the metal. 失效为了实现有机物体的金属化工艺在金属的粘附性。
公开(公告)号：EP0206145A2
公开(公告)日：1986-12-30
申请号：EP86108025
申请日：1986-06-12
Applicant: IBM
Inventor： CLABES JOACHIM GERHARD , HAHN PETER OTTO , HO PAUL SIU-CHUNG , LEFAKIS HARALAMBOS NMN , RUBLOFF GARY WAYNE
CPC classification number: B29C59/16 , B29C2035/0872 , B29C2035/0877 , B29K2079/00 , C23C14/022 , C23C16/0263
Abstract: Metal-organic substrate adhesion is improved by irradiating the substrate with low energy reactive ions, electrons, or photons to alter the chemical composition of a surface layer of the substrate to a depth of from about 1 nm to a few tens of nanometers. The energy of the incident reactive ions and electrons can be in the range of about 50 to 2000 eV, while the energy of the incident photons can be in the range of about 0.2 - 500 eV. Irradiation of the substrate can occur prior to or during metal deposition. For simultaneous metal deposition/particle irradiation, the arrival rates of the metal atoms and the substrate treatment particles are within a few orders of magnitude of one another. The low energy irradiation can be conducted at room temperature or elevated temperatures.
Abstract translation: 金属 - 有机底物的粘附，通过照射与低能量的反应性的离子，电子或光子的衬底以从约1nm改变衬底的表面层的至的深度的化学成分到几十纳米米提高。 入射反应性离子和电子的能量可在约50至2000伏特的范围内，而入射光子的能量可在约0.2的范围内 - 500eV的。 基板的照射可以之前或期间金属沉积好发。 对于同时金属沉积/颗粒的照射下，金属原子的到达率与基板处理颗粒是彼此的大小的几个数量级之内。 低能量照射可以在室温下或升高的温度下进行。
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公开(公告)号：DE3674645D1
公开(公告)日：1990-11-08
申请号：DE3674645
申请日：1986-06-12
Applicant: IBM
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