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    A method of metallising an organic substrate so as to achieve improved adhesion of the metal.
    1.
    发明公开
    A method of metallising an organic substrate so as to achieve improved adhesion of the metal. 失效
    为了实现有机物体的金属化工艺在金属的粘附性。

    公开(公告)号：EP0206145A2

    公开(公告)日：1986-12-30

    申请号：EP86108025

    申请日：1986-06-12

    Applicant: IBM

    Inventor： CLABES JOACHIM GERHARD ,  HAHN PETER OTTO ,  HO PAUL SIU-CHUNG ,  LEFAKIS HARALAMBOS NMN ,  RUBLOFF GARY WAYNE

    IPC: B29C35/08 ,  B29C59/16 ,  C08J7/00 ,  C23C14/02 ,  C23C14/20 ,  C23C16/02

    CPC classification number: B29C59/16 ,  B29C2035/0872 ,  B29C2035/0877 ,  B29K2079/00 ,  C23C14/022 ,  C23C16/0263

    Abstract: Metal-organic substrate adhesion is improved by irradiating the substrate with low energy reactive ions, electrons, or photons to alter the chemical composition of a surface layer of the substrate to a depth of from about 1 nm to a few tens of nanometers. The energy of the incident reactive ions and electrons can be in the range of about 50 to 2000 eV, while the energy of the incident photons can be in the range of about 0.2 - 500 eV. Irradiation of the substrate can occur prior to or during metal deposition. For simultaneous metal deposition/particle irradiation, the arrival rates of the metal atoms and the substrate treatment particles are within a few orders of magnitude of one another. The low energy irradiation can be conducted at room temperature or elevated temperatures.

    Abstract translation: 金属 - 有机底物的粘附，通过照射与低能量的反应性的离子，电子或光子的衬底以从约1nm改变衬底的表面层的至的深度的化学成分到几十纳米米提高。 入射反应性离子和电子的能量可在约50至2000伏特的范围内，而入射光子的能量可在约0.2的范围内 - 500eV的。 基板的照射可以之前或期间金属沉积好发。 对于同时金属沉积/颗粒的照射下，金属原子的到达率与基板处理颗粒是彼此的大小的几个数量级之内。 低能量照射可以在室温下或升高的温度下进行。

    Method of power consumption reduction in clocked circuit
    3.
    发明专利
    Method of power consumption reduction in clocked circuit 审中-公开
    时钟电路中功耗降低的方法

    公开(公告)号：JP2003022293A

    公开(公告)日：2003-01-24

    申请号：JP2002075699

    申请日：2002-03-19

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

    Inventor： CHU SAM GAT-SHANG ,  CLABES JOACHIM GERHARD ,  GOULET MICHAEL NORMAND ,  ROSSER THOMAS EDWARD ,  WARNOCK JAMES DOUGLAS

    IPC: G06F1/10 ,  G06F1/12 ,  G06F17/50 ,  H03K3/037

    CPC classification number: G06F17/505

    Abstract: PROBLEM TO BE SOLVED: To provide a method and device for reducing the power consumption of a clocked circuit including a plurality of latches. SOLUTION: A first latch which has more than a prescribed slack is detected within the plurality of latches. Then, the possibility of substituting an available second latch (requiring less power to operate) is determined subject to the constraint that the slack after substitution should still be positive although it may be less than the prescribed number above. When such a possibility is determined to exist, the first latch is replaced with the available second latch.

    Abstract translation: 要解决的问题：提供一种降低包括多个锁存器的时钟电路的功耗的方法和装置。 解决方案：在多个锁存器内检测到具有多于规定松弛度的第一锁存器。 然后，取决于可用的第二个锁存器（需要更少的功率来操作）的可能性被确定为受限制，即替换后的松弛仍然是正的，尽管它可能小于上述规定的数量。 当确定存在这种可能性时，第一锁存器被可用的第二锁存器替换。

    Chip heat responsive method and computer apparatus
    5.
    发明专利
    Chip heat responsive method and computer apparatus 有权
    芯片热响应方法和计算机设备

    公开(公告)号：JP2004295883A

    公开(公告)日：2004-10-21

    申请号：JP2004073517

    申请日：2004-03-15

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： CLABES JOACHIM GERHARD ,  POWELL JR LAWRENCE JOSEPH ,  STASIAK DANIEL LAWRENCE ,  WANG MICHAEL FAN

    IPC: G06F1/00 ,  G01K3/00 ,  G06F1/20 ,  H01L21/822 ,  H01L27/04

    CPC classification number: G06F1/206 ,  G01K3/005 ,  G06F1/324 ,  Y02D10/126

    Abstract: PROBLEM TO BE SOLVED: To provide an apparatus incorporating hardware based logic and a predetermined default list of software affecting responses to be taken in connection with temperature sensed by thermal sensors for detecting the temperature of portions of a computer logic circuit.
    SOLUTION: When application software is loaded, the software can modify the default response list. The list of responses to be taken and the over temperature conditions at which the responses are to be activated are stored in hardware directly accessible by a hardware based thermal sensor monitoring logic circuit for direct control of the hardware. The control can alter conditions such as clock frequency, stopping use of application software, interrupting OS function, removing power from components and so forth.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种包含基于硬件的逻辑的装置和影响响应的软件的预定默认列表，该温度与由热传感器感测的温度相关联以检测计算机逻辑电路的部分的温度而被采用。

    解决方案：加载应用软件时，软件可以修改默认的响应列表。 要采取的响应列表和响应被激活的过热条件存储在可由硬件的热传感器监控逻辑电路直接访问的硬件中，以直接控制硬件。 该控制可以改变时钟频率，停止应用软件的使用，中断OS功能，从组件中移除电源等状况。 版权所有（C）2005，JPO＆NCIPI

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