公开(公告)号：AU2003251438A1

公开(公告)日：2004-03-11

申请号：AU2003251438

申请日：2003-07-22

Applicant: IBM

Inventor： DARBHA KRISHNA ,  HENDERSON DONALD W ,  LEHMAN LAWRENCE P ,  THIEL GEORGE H ,  CALETKA DAVID V

IPC: B23K35/14 ,  B23K35/26 ,  C22C12/00 ,  C22C13/02 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H05K3/28 ,  H05K3/34 ,  H01R4/00

Abstract: An electronic package is provided including a substrate, a device mounted on the substrate, and a solder member electrically coupling the device to the substrate. The package includes a dielectric material positioned substantially around the solder member which forms a physical connection between the substrate and the device. The volume of the solder member contracts during melting thereof to prevent failure of the physical connection and/or the electrical coupling between the substrate and the device.