公开(公告)号：DE3377096D1

公开(公告)日：1988-07-21

申请号：DE3377096

申请日：1983-03-15

Applicant: IBM

Inventor： LOCKE CHARLES HENRY

IPC: H01G4/232 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H01G1/147

Abstract: The multi-layer ceramic capacitor structure (1) is capable of embodying multiple capacitors of various maximum voltage and capacitance rating. The structure (1) features a ceramic body (2) including multiple sections (3) having a dielectric element (4A, B, C) and companion plate (5A, B, C) of one or more types, the types defined by the number and placement of plate tabs (8A, B, C). The sections (3) are aligned in the body (2) such that the plates (5A, B, C) are located at displaced intervals in the direction of the body length while the plate tabs (8A, B, C) are located at displaced intervals in the direction of the body width and exposed at a common body face (11). Grooves (17) are provided in the common face (11) to align tabs (8A, B, C) in groups and to maintain the groups separated. Grooves (17) have the effect that the maximum voltage the structure (1) can withstand is not reduced due to mis-alignment of tabs (8A, B, C) during formation of body (2). Buses (12A, B, C) interconnect the tabs (8A, B, C) and plates (5A, B, C) in groups at common face (11). By selectively connecting the buses (12A, B, C), one or more capacitors may be formed in body (2). The method features steps for grooving the common face (11) and simultaneously aligning tabs (8A, B, C) in body (2).

公开(公告)号：DE3582404D1

公开(公告)日：1991-05-08

申请号：DE3582404

申请日：1985-11-12

Applicant: IBM

Inventor： BEUMER KARL WILLI ,  GASTON CHARLES ARDEN ,  MACK ALFRED ,  O'NEILL BRIAN COLLINS ,  PINCKNEY WARREN JOHN ,  LOCKE CHARLES HENRY ,  WILSON ALAN DICKSON

IPC: H01L21/30 ,  H01J37/20 ,  H01L21/027 ,  H01L21/68 ,  H05K13/02 ,  H01L21/00

Abstract: A high precision, high throughput submicrometer workpiece positioning system, particularly useful as a workpiece positioning means in electron beam lithography tools. The positioning system increases mechanical stability by essentially eliminating mechanical hysteresis, which allows state of the art electron beam lithography systems to provide the repeatable, accurate and dense circuit patterns that modern semiconductor trends demand.The positioning system comprises a movable positioning table (12), a workpiece supporting superstructure (14) which is elastically joined to the movable positioning table (12) by three geometrically distinct kinematic support means (16. 18, 20) and a two-stage coupling means (24) which mounts a workpiece (32) (i.e., semiconductor mask or wafer) to the workpiece supporting superstructure (14). A laser interferometer locating-positioning system is utilized to position the workpfece. The interferometer mirrors (28) are integral with the workpiece supporting superstructure (14).The coupling means (24) mounts a workpiece (22) to the workpiece supporting superstructure (14) with a minimum of mechanical distortion. Three two-stage coupling means (24) are utilized in preferred form. The first stage (34) is removable from the positioning, and allows for workpiece loading and unloading outside of the positioning system. The removable stage (34) comprises an integral unit (33) which includes two opposing arms (42, 44) with large radii spherical ends and a tab member. The spherical end center lines are collinear, providing for vertical clamping of the workpiece (32). The second stage (36) is stationary and integral with the workpiece supporting superstructure (14). The stationary stage (36) comprises two opposing arms (38, 40) with large radii spherical ends and clamps the tab (46) of the removable stage by verticai clamping.