公开(公告)号：DE3166926D1

公开(公告)日：1984-12-06

申请号：DE3166926

申请日：1981-05-25

Applicant: IBM

Inventor： CACCOMA GEORGE ANTHONY ,  KOESTNER JOSEPH HENRY ,  O'NEILL BRIAN COLLINS ,  TAPPEN FRANK MUIR

IPC: H01L21/60 ,  H01L21/67 ,  H05K13/04 ,  H01L21/68

Abstract: A batch chip placement system for batch positioning semiconductor chips, or the like, upon a substrate containing an array of chip sites or footprints whose actual position on the substrate deviates from the theoretical or nominal position over successive substrates. The positioning is achieved by first sensing the X and Y offsets of a pair of alignment marks on the substrate from their theoretical or nominal position to determine the DELTA X and DELTA Y correction factors required to obtain the actual X,Y position of the alignment marks. The actual X,Y position of the alignment marks is used to determine actual X,Y chip position values, theta rotation and shrinkage factor corrections required to obtain proper orientation and positioning for batch chip placement.

公开(公告)号：DE3582404D1

公开(公告)日：1991-05-08

申请号：DE3582404

申请日：1985-11-12

Applicant: IBM

Inventor： BEUMER KARL WILLI ,  GASTON CHARLES ARDEN ,  MACK ALFRED ,  O'NEILL BRIAN COLLINS ,  PINCKNEY WARREN JOHN ,  LOCKE CHARLES HENRY ,  WILSON ALAN DICKSON

IPC: H01L21/30 ,  H01J37/20 ,  H01L21/027 ,  H01L21/68 ,  H05K13/02 ,  H01L21/00

Abstract: A high precision, high throughput submicrometer workpiece positioning system, particularly useful as a workpiece positioning means in electron beam lithography tools. The positioning system increases mechanical stability by essentially eliminating mechanical hysteresis, which allows state of the art electron beam lithography systems to provide the repeatable, accurate and dense circuit patterns that modern semiconductor trends demand.The positioning system comprises a movable positioning table (12), a workpiece supporting superstructure (14) which is elastically joined to the movable positioning table (12) by three geometrically distinct kinematic support means (16. 18, 20) and a two-stage coupling means (24) which mounts a workpiece (32) (i.e., semiconductor mask or wafer) to the workpiece supporting superstructure (14). A laser interferometer locating-positioning system is utilized to position the workpfece. The interferometer mirrors (28) are integral with the workpiece supporting superstructure (14).The coupling means (24) mounts a workpiece (22) to the workpiece supporting superstructure (14) with a minimum of mechanical distortion. Three two-stage coupling means (24) are utilized in preferred form. The first stage (34) is removable from the positioning, and allows for workpiece loading and unloading outside of the positioning system. The removable stage (34) comprises an integral unit (33) which includes two opposing arms (42, 44) with large radii spherical ends and a tab member. The spherical end center lines are collinear, providing for vertical clamping of the workpiece (32). The second stage (36) is stationary and integral with the workpiece supporting superstructure (14). The stationary stage (36) comprises two opposing arms (38, 40) with large radii spherical ends and clamps the tab (46) of the removable stage by verticai clamping.

公开(公告)号：DE3171231D1

公开(公告)日：1985-08-08

申请号：DE3171231

申请日：1981-09-16

Applicant: IBM

Inventor： MACK ALFRED ,  O'NEILL BRIAN COLLINS ,  PENZETTA FRED L

IPC: H01J37/20 ,  H01J37/18 ,  H01L21/027 ,  H01L21/66

Abstract: This invention is directed to mechanisms for sealing off a small volume antechamber (36) from a main vacuum chamber (10) forming a component of an electron beam writing system. The mechanisms eliminate shock and vibration transmission to an electron beam column (4) to permit electron beam writing in parallel with and simultaneously with a load/unload operation involving the antechamber. The mechanism comprise mechanical override means (62) for dampening impact during sealing and means (84, 136) for preventing vibration transfer.

公开(公告)号：DE3169064D1

公开(公告)日：1985-03-28

申请号：DE3169064

申请日：1981-09-16

Applicant: IBM

Inventor： MACK ALFRED ,  O'NEILL BRIAN COLLINS

IPC: H01J37/20 ,  H01L21/027 ,  H01L21/66 ,  H01L21/677 ,  H01L21/687