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公开(公告)号:JP2000174435A
公开(公告)日:2000-06-23
申请号:JP30733399
申请日:1999-10-28
Applicant: IBM
Inventor: KENNETH FALLON , MAIGUERU A JIMAAZU , ROSS W KEITHLER , LAUFFER JOHN M , ROY H MAGNUSON , VOYA R MARKOVICH , AIRA MENISU , JIM P PAOLETTI , MAARIBESU PERINO , JOHN A WELSH , WILLIAM E WILSON
Abstract: PROBLEM TO BE SOLVED: To obtain a circuit card, in which layers made of dielectric material for exposure type latent image formation are used on both opposing surfaces of a metal layer forming a power plane. SOLUTION: This method is provided for forming a printed circuit card. A metal layer 20 which functions as a power plane is sandwiched by a pair of layers 24 and 26 of a photoimageable material, capable of forming a latent with use of a light beam. Photoformed metal-filled vias 46 and photoformed plating through-hole 48 are in a photopatternable material. A signal circuit is formed on the two dielectric layers to be connected to the vias 46 and a through-hole 48. The board has a border 14 in its periphery, and the metal layer 20 has an end which is apart from an end of one 26 of the dielectric layers.