公开(公告)号：JP2000174435A

公开(公告)日：2000-06-23

申请号：JP30733399

申请日：1999-10-28

Applicant: IBM

Inventor： KENNETH FALLON ,  MAIGUERU A JIMAAZU ,  ROSS W KEITHLER ,  LAUFFER JOHN M ,  ROY H MAGNUSON ,  VOYA R MARKOVICH ,  AIRA MENISU ,  JIM P PAOLETTI ,  MAARIBESU PERINO ,  JOHN A WELSH ,  WILLIAM E WILSON

IPC: H05K3/42 ,  H05K1/05 ,  H05K3/00 ,  H05K3/10 ,  H05K3/44

Abstract: PROBLEM TO BE SOLVED: To obtain a circuit card, in which layers made of dielectric material for exposure type latent image formation are used on both opposing surfaces of a metal layer forming a power plane. SOLUTION: This method is provided for forming a printed circuit card. A metal layer 20 which functions as a power plane is sandwiched by a pair of layers 24 and 26 of a photoimageable material, capable of forming a latent with use of a light beam. Photoformed metal-filled vias 46 and photoformed plating through-hole 48 are in a photopatternable material. A signal circuit is formed on the two dielectric layers to be connected to the vias 46 and a through-hole 48. The board has a border 14 in its periphery, and the metal layer 20 has an end which is apart from an end of one 26 of the dielectric layers.

公开(公告)号：JP2000174441A

公开(公告)日：2000-06-23

申请号：JP30748199

申请日：1999-10-28

Applicant: IBM

Inventor： LAUFFER JOHN M ,  ROY H MAGNUSON ,  VOYA R MARKOVICH ,  JOHN A WELSH

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To form a chip carrier having two voltage faces and at least two signal faces by exposing a first layer made of dielectric material attached to a first metal layer to form openings which pass through the first layer. SOLUTION: A first layer 10 made of dielectric material is attached to a first metal layer 12 and then the first layer 10 is exposed to form openings which pass through the first layer 10. Then, a second metal layer 16 is attached to the first layer 10 and holes larger than corresponding opening patterns of the first layer 10 are formed by etching in the first and the second metal layer 12, 16 in correspondence to each opening pattern and then an exposure pattern on the first layer 10 is developed. The openings formed in the first and the second metal layer are larger than those of the first layer 10. Then, a second and a third layer 32, 34 which are capable of light image formation are attached to the first and the second metal layer 12, 16 respectively and then are formed into light patterns and developed to form openings corresponding to each hole of the first layer 10 in the second and the third layer 32, 34. Then, the first and the second metal layer 12, 16 are formed with holes which are terminated at the metal layer in the lower layer. Parts of the surfaces of the second and the third dielectric material are exposed and holes are filled with plating or metal.