公开(公告)号：JPH04276653A

公开(公告)日：1992-10-01

申请号：JP35108891

申请日：1991-12-11

Applicant: IBM

Inventor： MAIKERU MONKOUSUKI ,  SEIKI OGURA ,  NIBUO ROBUEDO ,  JIYOZEFU FURANSHISU SHIEPAADO

IPC: H01L27/06 ,  H01L21/225 ,  H01L21/763 ,  H01L21/8249

Abstract: PURPOSE: To easily assemble an integrated circuit device which uses circuit elements on the same chip by different technologies. CONSTITUTION: This process includes a state for forming part of a circuit element at the same time by both CMOS and bipolar technologies, a stage for making the circuit element by to the bipolar technology and partially completing the circuit element by the CMOS technology, a stage for masking the circuit element by the CMOS technology and completing the circuit element by the bipolar technology, and a stage for completing the circuit element by the CMOS technology. A self-aligning and self-making process is used at a maximum and several stages are performed at the same time for devices of different technologies to decrease the number of stages. Further, making stage in use has allowance for a position shift, so the manufacture yield becomes high.