公开(公告)号：SG44058A1

公开(公告)日：1997-11-14

申请号：SG1996010841

申请日：1996-10-14

Applicant: IBM

Inventor： BHATT ANILKUMAR CHINUPRASAD ,  BHATT ASHWINKUMAR CHINUPRASAD ,  DAY ROBERT JEFFERY ,  DUFFY THOMAS PATRICK ,  KNIGHT JEFFERY ALAN ,  MALEK RICHARD WILLIAM ,  MARKOVICH VOYA RISTA

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/42 ,  C25D5/02 ,  H05K3/02

Abstract: A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e.g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.