公开(公告)号：CA1057417A

公开(公告)日：1979-06-26

申请号：CA267434

申请日：1976-12-08

Applicant: IBM

Inventor： MCBRIDE DONALD G ,  PALLADY PHILIP H

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/482 ,  H05K1/14 ,  H05K1/04

Abstract: INGROWN LEAD FRAME WITH STRAIN RELIEF A method for providing a large number of interconnections between a circuitizable wafer and a circuitizable substrate provides very fine line interconnections with built-in strain relief. A channel between the respective substrates is filled with a solvent soluble material which is applied in a manner such that a convex or concave shape is attained in the channel between the material. A sensitizer may be mixed with the solvent soluble material prior to its placement in the channel between the substrates, and then a photoresist is applied to the composite, exposed and developed, yielding the desired circuit configuration. Next, copper leads are additively electrolessly plated to the desired thickness in the exposed circuit areas. after the leads have been formed, the solvent soluble material is removed leaving curved, strain relief leads suspended in air with the two ends interconnecting the substrates.

公开(公告)号：CA1229266A

公开(公告)日：1987-11-17

申请号：CA503760

申请日：1986-03-11

Applicant: IBM

Inventor： AMELIO WILLIAM J ,  HUME DAVID W ,  MCBRIDE DONALD G ,  RICKERT ROBERT G

IPC: H05K3/18 ,  C23C18/20 ,  C23C18/24 ,  H05K3/42

Abstract: PROCESS FOR PREPARING A SUBSTRATE FOR SUBSEQUENT ELECTROLESS DEPOSITION OF A METAL A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.