公开(公告)号：DE3668474D1

公开(公告)日：1990-03-01

申请号：DE3668474

申请日：1986-08-14

Applicant: IBM

Inventor： AMELIO WILLIAM J ,  MARKOVICH VOYA ,  SAMBUCETTI CARLOS J ,  TREVITT DONNA J

IPC: C23C18/31 ,  C23C18/16 ,  G01N27/26 ,  G01N27/48 ,  C23C18/40 ,  C25F3/02

Abstract: A process for monitoring an electroless plating bath (1) to determine whether it is in a take mode, by electrolessly depositing a film of the metal of the plating bath onto a substrate to provide a preplated cathode (5); providing the cathode (5), a reference electrode (4), and an anode (6) in the electroless bath; passing an electric current and varying the voltage difference, plotting the voltage difference versus the current; and comparing the oxidation peak of the reducing agent to the oxidation peak of the reduced state of the metal ion to be plated, to thereby determine whether the bath (1) is in a take mode.

公开(公告)号：CA1293605C

公开(公告)日：1991-12-31

申请号：CA533598

申请日：1987-04-01

Applicant: IBM

Inventor： AMELIO WILLIAM J ,  MARKOVICH VOYA ,  MCCARTHY WILLIAM J ,  MORING ALLEN F ,  MOSCHAK PETER A ,  STROPE DOUGLAS H

IPC: C08J5/24 ,  B29B13/02 ,  B29B13/06 ,  B29B15/08 ,  B29C70/06 ,  B29C71/00 ,  B29K63/00 ,  B29K105/06 ,  B29L9/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46

Abstract: EN985-039 PROCESS FOR TREATING REINFORCED POLYMER COMPOSITE Reinforced synthetic polymer composite is treated by heating at a temperature and for a time sufficient to obtain a moisture content below that for the relative humidity level at which the composite is to be drilled and/or photoresist exposed; and then subjecting it to conditions to increase the moisture content to that for the relative humidity level of the drilling.

公开(公告)号：CA1229266A

公开(公告)日：1987-11-17

申请号：CA503760

申请日：1986-03-11

Applicant: IBM

Inventor： AMELIO WILLIAM J ,  HUME DAVID W ,  MCBRIDE DONALD G ,  RICKERT ROBERT G

IPC: H05K3/18 ,  C23C18/20 ,  C23C18/24 ,  H05K3/42

Abstract: PROCESS FOR PREPARING A SUBSTRATE FOR SUBSEQUENT ELECTROLESS DEPOSITION OF A METAL A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.