公开(公告)号：JPS61279681A

公开(公告)日：1986-12-10

申请号：JP4428086

申请日：1986-03-03

Applicant: IBM

Inventor： CAPWELL ROBERT J ,  RICKERT ROBERT G

IPC: C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  H05K3/18

公开(公告)号：CA1225549A

公开(公告)日：1987-08-18

申请号：CA506444

申请日：1986-04-11

Applicant: IBM

Inventor： CAPWELL ROBERT J ,  RICKERT ROBERT G

IPC: C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  H05K3/18 ,  C23C18/38

Abstract: ELECTROLESS PLATING BATH MONITOR Method and apparatus for determining the deposition capability of an electroless metal plating bath by monitoring the difference in instantaneous electrical potential between a pair of test coupons immersed in the bath in which one coupon is seeded to initiate plating thereon of the bath metal and the other coupon has a surface of the bath metal. The magnitude of the difference in potential and its change with respect to time during concurrent immersion of both coupons indicate the probable rate and quality of the bath deposition onto work pieces. EN983035

公开(公告)号：CA1229266A

公开(公告)日：1987-11-17

申请号：CA503760

申请日：1986-03-11

Applicant: IBM

Inventor： AMELIO WILLIAM J ,  HUME DAVID W ,  MCBRIDE DONALD G ,  RICKERT ROBERT G

IPC: H05K3/18 ,  C23C18/20 ,  C23C18/24 ,  H05K3/42

Abstract: PROCESS FOR PREPARING A SUBSTRATE FOR SUBSEQUENT ELECTROLESS DEPOSITION OF A METAL A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.