公开(公告)号：CH645602A5

公开(公告)日：1984-10-15

申请号：CH38779

申请日：1979-01-16

Applicant: IBM

Inventor： KUMAR ANANDA HOSAKERE ,  MCMILLAN PETER ,  TUMMALA RAO RAMAMOHANA

IPC: H01L21/70 ,  C03C3/083 ,  C03C3/085 ,  C03C3/091 ,  C03C10/00 ,  C03C10/06 ,  C03C10/12 ,  H01B3/02 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/52 ,  H05K1/03 ,  H05K3/46 ,  C03B19/06 ,  C03C3/22

公开(公告)号：DE2901172A1

公开(公告)日：1979-08-16

申请号：DE2901172

申请日：1979-01-13

Applicant: IBM

Inventor： KUMAR ANANDA HOSAKERE ,  MCMILLAN PETER ,  TUMMALA RAO RAMAMOHANA

IPC: H01L21/70 ,  C03C3/083 ,  C03C3/085 ,  C03C3/091 ,  C03C10/00 ,  C03C10/06 ,  C03C10/12 ,  H01B3/02 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/52 ,  H05K1/03 ,  H05K3/46 ,  C03C3/22 ,  C03B32/00

Abstract: Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000 DEG C. while simultaneously maturing to glass-ceramics of low dielectric constant, high flexural strength and low thermal expansivity.