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    1.
    发明专利
    未知

    公开(公告)号：DE69204340T2

    公开(公告)日：1996-03-21

    申请号：DE69204340

    申请日：1992-03-13

    Applicant: IBM

    Inventor： DIPAOLO NUNZIO ,  KUMAR ANANDA HOSAKERE ,  WIGGINS LOVELL BERRY

    IPC: C03C17/06 ,  C03C27/04 ,  C04B37/02 ,  H01B1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/22

    Abstract: Disclosed is a method for promoting adhesion of cofired copper-based metallurgy and glass-ceramic dielectric including the step of adding powders of an alloying metal to the copper-based metallurgy prior to firing. Also disclosed is a metallizing paste exhibiting superior adhesion to glass-ceramics. The paste includes an organic carrier, copper powder and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent.

    2.
    发明专利
    未知

    公开(公告)号：BR8504923A

    公开(公告)日：1986-07-22

    申请号：BR8504923

    申请日：1985-10-07

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  KUMAR ANANDA HOSAKERE

    IPC: H01L23/12 ,  C23C10/04 ,  H01L21/388 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  B05D3/12

    Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

    3.
    发明专利
    未知

    公开(公告)号：DE69204340D1

    公开(公告)日：1995-10-05

    申请号：DE69204340

    申请日：1992-03-13

    Applicant: IBM

    Inventor： DIPAOLO NUNZIO ,  KUMAR ANANDA HOSAKERE ,  WIGGINS LOVELL BERRY

    IPC: C03C17/06 ,  C03C27/04 ,  C04B37/02 ,  H01B1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/22

    Abstract: Disclosed is a method for promoting adhesion of cofired copper-based metallurgy and glass-ceramic dielectric including the step of adding powders of an alloying metal to the copper-based metallurgy prior to firing. Also disclosed is a metallizing paste exhibiting superior adhesion to glass-ceramics. The paste includes an organic carrier, copper powder and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent.

    DIFFUSION ISOLATION LAYER IN A COATING PROCESS
    4.
    发明专利
    DIFFUSION ISOLATION LAYER IN A COATING PROCESS 未知

    公开(公告)号：AU569805B2

    公开(公告)日：1988-02-18

    申请号：AU4791285

    申请日：1985-09-26

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  KUMAR ANANDA HOSAKERE ,  NUFER ROBERT WOLFF

    IPC: H01L23/12 ,  C23C10/04 ,  H01L21/388 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/28

    Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

    DIFFUSION ISOLATION LAYER IN A COATING PROCESS
    7.
    发明专利
    DIFFUSION ISOLATION LAYER IN A COATING PROCESS 未知

    公开(公告)号：AU4791285A

    公开(公告)日：1986-05-08

    申请号：AU4791285

    申请日：1985-09-26

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  KUMAR ANANDA HOSAKERE ,  NUFER ROBERT WOLFF

    IPC: H01L23/12 ,  C23C10/04 ,  H01L21/388 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/28

    Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

    8.
    发明专利
    未知

    公开(公告)号：DK495885A

    公开(公告)日：1986-05-01

    申请号：DK495885

    申请日：1985-10-29

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  KUMAR ANANDA HOSAKERE

    IPC: H01L23/12 ,  C23C10/04 ,  H01L21/388 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  C23C18/00

    Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

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