公开(公告)号：CA1122789A

公开(公告)日：1982-05-04

申请号：CA377129

申请日：1981-05-07

Applicant: IBM

Inventor： KUMAR ANANDA H ,  MCMILLAN PETER W ,  TUMMALA RAO R

IPC: E04F21/00

Abstract: GLASS-CERAMIC STRUCTURES AND SINTERED MULTILAYER SUBSTRATES THEREOF WITH CIRCUIT PATTERNS OF GOLD, SILVER OR COPPER Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000.degree.C while simultaneously maturing to glass-ceramics of low dielectric constant, high flexural strength and low thermal expansivity.

公开(公告)号：FR2416203A1

公开(公告)日：1979-08-31

申请号：FR7837093

申请日：1978-12-28

Applicant: IBM

Inventor： KUMAR ANANDA H ,  MCMILLAN PETER W ,  TUMMALA RAO R

IPC: H01L21/70 ,  C03C3/083 ,  C03C3/085 ,  C03C3/091 ,  C03C10/00 ,  C03C10/06 ,  C03C10/12 ,  H01B3/02 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/52 ,  H05K1/03 ,  H05K3/46 ,  C03C3/22 ,  C03C27/12 ,  B32B17/00 ,  C03B32/00

Abstract: Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000 DEG C. while simultaneously maturing to glass-ceramics of low dielectric constant, high flexural strength and low thermal expansivity.

公开(公告)号：CA1109664A

公开(公告)日：1981-09-29

申请号：CA314417

申请日：1978-10-26

Applicant: IBM

Inventor： KUMAR ANANDA H ,  MCMILLAN PETER W ,  TUMMALA RAO R

IPC: H01L21/70 ,  C03C3/083 ,  C03C3/085 ,  C03C3/091 ,  C03C10/00 ,  C03C10/06 ,  C03C10/12 ,  H01B3/02 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/52 ,  H05K1/03 ,  H05K3/46 ,  H01G4/12

Abstract: GLASS-CERAMIC STRUCTURES AND SINTERED MULTILAYER SUBSTRATES THEREOF WITH CIRCUIT PATTERNS OF GOLD, SILVER OR COPPER Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000.degree.C while simultaneously maturing to glass-ceramics-of low dielectric constant, high flexural strength and low thermal expansivity.