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    MASKLESS COATING OF METALLURGICAL FEATURES OF A DIELECTRIC SUBSTRATE
    1.
    发明专利
    MASKLESS COATING OF METALLURGICAL FEATURES OF A DIELECTRIC SUBSTRATE 未知

    公开(公告)号：CA1189748A

    公开(公告)日：1985-07-02

    申请号：CA419631

    申请日：1983-01-17

    Applicant: IBM

    Inventor： KUMAR ANANDA H

    IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/04 ,  H05K3/14 ,  H05K3/24 ,  B05D3/12 ,  B05D5/12

    Abstract: Maskless Coating of Metallurgical Features of a Dielectric Substrate Maskless technique for plating a protective metal layer on existing metallurgical pattern supported on a dielectric substrate by blanket coating said metal layer over said substrate, heating to diffuse the metal into said pattern, and cooling to spall the metal on the non-patterned portions of the substrate surfaces, and mechanically removing the metal layer from the non-patterned substrate surfaces. Optionally, the metal layer can also be blanket coated with a passivating metal film with interdiffusion between them at their interface during the noted heating step. In application to support carries for mounting of semiconductor devices, the substrate will comprise an alumina cased ceramic, the pattern will comprise a molybdenum based metal, and the protective metal layer can comprise a nickel based metal. In this application, the second passivating metal film can comprise gold.

    2.
    发明专利
    未知

    公开(公告)号：DE3481606D1

    公开(公告)日：1990-04-19

    申请号：DE3481606

    申请日：1984-11-23

    Applicant: IBM

    Inventor： KUMAR ANANDA H ,  SCHWARTZ BERNARD

    IPC: H05K3/46 ,  C04B41/45 ,  C04B41/52 ,  C04B41/81 ,  C04B41/89 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K3/24 ,  C04B41/88

    Abstract: A blanket layer (81) of a sintering agent, like palladium, is coated on a polyvinyl butyral resin layer (82) on a polyester film (83). Said coated polyester film is superimposed on a unsintered dielectric substrate provided with a metallurgical pattern of a refractory metal, like molybdenum, in such a way, that the sintering agent layer (81) is adjacent the metallurigcal pattern (55) and the unsintered dielectric substrate (50). The polyester film (83) is stripped, while said polyvinyl butyral layer (82) and said sintering agent layer (81) remain on the surface of the metallurgical pattern (55) and said unsintered dielectric substrate. The resulting composite is sintered to a fired structure, whereby said sintering agent is alloyed with the metallurgical pattern whereas said polyvinyl butyral and said sintering agent not in contact with the metallurigcal pattern (55) are volatilized off. The finished structure has a metallurgical pattern with a densified surface. … If the substrate consists of a ceramic containing a certain amount of a glass frit the metallurgical pattern having undergone the inventive process is substantially glass-free.

    DIFFUSION ISOLATION LAYER FOR MASKLESS CLADDING PROCESS
    5.
    发明专利
    DIFFUSION ISOLATION LAYER FOR MASKLESS CLADDING PROCESS 未知

    公开(公告)号：CA1267990A

    公开(公告)日：1990-04-17

    申请号：CA490982

    申请日：1985-09-18

    Applicant: IBM

    Inventor： HERRON LESTER W ,  KUMAR ANANDA H ,  NUFER ROBERT W

    IPC: H01L23/12 ,  C23C10/04 ,  H01L21/388 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  B05D3/12 ,  C23C14/00 ,  B05D5/12

    Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern, a protective layer is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay. The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

    GLASS-CERAMIC STRUCTURES AND SINTERED MULTILAYER SUBSTRATES THEREOF WITH CIRCUIT PATTERNS OF GOLD, SILVER OR COPPER
    6.
    发明专利
    GLASS-CERAMIC STRUCTURES AND SINTERED MULTILAYER SUBSTRATES THEREOF WITH CIRCUIT PATTERNS OF GOLD, SILVER OR COPPER 未知

    公开(公告)号：CA1122789A

    公开(公告)日：1982-05-04

    申请号：CA377129

    申请日：1981-05-07

    Applicant: IBM

    Inventor： KUMAR ANANDA H ,  MCMILLAN PETER W ,  TUMMALA RAO R

    IPC: E04F21/00

    Abstract: GLASS-CERAMIC STRUCTURES AND SINTERED MULTILAYER SUBSTRATES THEREOF WITH CIRCUIT PATTERNS OF GOLD, SILVER OR COPPER Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000.degree.C while simultaneously maturing to glass-ceramics of low dielectric constant, high flexural strength and low thermal expansivity.

    DIFFUSION ISOLATION LAYER FOR MASKLESS CLADDING PROCESS
    8.
    发明专利
    DIFFUSION ISOLATION LAYER FOR MASKLESS CLADDING PROCESS 未知

    公开(公告)号：CA1312405C

    公开(公告)日：1993-01-05

    申请号：CA615552

    申请日：1989-11-07

    Applicant: IBM

    Inventor： HERRON LESTER W ,  KUMAR ANANDA H ,  NUFER ROBERT W

    IPC: H01L21/48

    Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern, a protective layer is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay. The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics. FI9-84-010B

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