公开(公告)号：DE69115799T2

公开(公告)日：1996-07-11

申请号：DE69115799

申请日：1991-06-26

Applicant: IBM

Inventor： MELNICK PAUL JOHN ,  MENNELLA ANTHONY JOSEPH ,  MEYER HERMAN PAUL

IPC: H01L23/02 ,  H01L21/98 ,  H01L23/32 ,  H01L25/07

Abstract: A heat-conductive honeycomb ceramic spacer (11) having an array of apertures therein for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks (13) using a low-profile contact comprising a foil (12) with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet (14). Use of such a foil also allows disconnection of defective stacks in the device which includes extra stacks to compensate therefore, according to an n - x philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.

公开(公告)号：DE69115799D1

公开(公告)日：1996-02-08

申请号：DE69115799

申请日：1991-06-26

Applicant: IBM

Inventor： MELNICK PAUL JOHN ,  MENNELLA ANTHONY JOSEPH ,  MEYER HERMAN PAUL

IPC: H01L23/02 ,  H01L21/98 ,  H01L23/32 ,  H01L25/07

Abstract: A heat-conductive honeycomb ceramic spacer (11) having an array of apertures therein for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks (13) using a low-profile contact comprising a foil (12) with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet (14). Use of such a foil also allows disconnection of defective stacks in the device which includes extra stacks to compensate therefore, according to an n - x philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.