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1.发明授权Transistor switching regulator control utilizing charging of bootstrap circuit to provide ramp-up 失效晶体管开关稳压器控制利用自举电路的充电提供斜升
公开(公告)号：US3916224A
公开(公告)日：1975-10-28
申请号：US38511973
申请日：1973-08-02
Applicant: IBM
Inventor： DANIELS RICHARD JOSEPH , MENNELLA ANTHONY JOSEPH
CPC classification number: H03K3/78
Abstract: A transistor switching regulator having a pulse width control which includes a minimum pulse output, a ''''ramp-up'''' start pulse output and a feedback controlled running pulse output sequenced to start up and run the transistor switching regulator in a controlled manner. The three pulse outputs are derived from an emitter coupled astable multivibrator having a linearizing boot strap circuit, coupled to one of its emitter output circuits and having a long time constant for gradually charging the capacitor of the boot strap circuit during the ramp-up operation. A circuit which is sensitive to the boot strap circuit during the charging of its capacitor provides a sequence of pulses of gradually increasing width during the ramp-up operation.
Abstract translation: 具有脉冲宽度控制的晶体管开关调节器，其包括最小脉冲输出，“斜坡上升”起始脉冲输出和反馈控制的运行脉冲输出，其以受控的方式启动和运行晶体管开关调节器。 三个脉冲输出源自具有线性化引导电路的发射极耦合的非稳态多谐振荡器，耦合到其发射极输出电路之一并且具有长时间常数，用于在升高操作期间逐渐地对引导电路电容器充电。 在电容器充电期间对引导电路敏感的电路在斜升操作期间提供逐渐增加的脉冲序列。
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公开(公告)号：DE69115799T2
公开(公告)日：1996-07-11
申请号：DE69115799
申请日：1991-06-26
Applicant: IBM
Inventor： MELNICK PAUL JOHN , MENNELLA ANTHONY JOSEPH , MEYER HERMAN PAUL
Abstract: A heat-conductive honeycomb ceramic spacer (11) having an array of apertures therein for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks (13) using a low-profile contact comprising a foil (12) with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet (14). Use of such a foil also allows disconnection of defective stacks in the device which includes extra stacks to compensate therefore, according to an n - x philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.
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公开(公告)号：DE69115799D1
公开(公告)日：1996-02-08
申请号：DE69115799
申请日：1991-06-26
Applicant: IBM
Inventor： MELNICK PAUL JOHN , MENNELLA ANTHONY JOSEPH , MEYER HERMAN PAUL
Abstract: A heat-conductive honeycomb ceramic spacer (11) having an array of apertures therein for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks (13) using a low-profile contact comprising a foil (12) with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet (14). Use of such a foil also allows disconnection of defective stacks in the device which includes extra stacks to compensate therefore, according to an n - x philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.
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