公开(公告)号：DE69114622D1

公开(公告)日：1995-12-21

申请号：DE69114622

申请日：1991-08-20

Applicant: IBM

Inventor： GORDON JAMES CARLTON ,  LOVGREN ERIC PAUL ,  MEYER HERMAN PAUL ,  REARICK DONALD PAUL

IPC: H01C1/02 ,  H01C1/08 ,  H01C1/084 ,  H05K7/20

公开(公告)号：AU607009B2

公开(公告)日：1991-02-21

申请号：AU2417888

申请日：1988-10-24

Applicant: IBM

Inventor： BIAMONTE ROBERT ANTHONY ,  BOGDANSKI JOSEPH WILLIAM ,  COVI KEVIN ROBERT ,  MEYER HERMAN PAUL ,  RAFKIND DANIEL IRA

IPC: G05F1/59 ,  H02H7/20 ,  H02J1/10 ,  H02J9/06 ,  H02M3/28 ,  H02J13/00 ,  G05F1/575 ,  G05F1/577

公开(公告)号：BR8805699A

公开(公告)日：1989-07-18

申请号：BR8805699

申请日：1988-11-03

Applicant: IBM

Inventor： BIAMONTE ROBERT ANTHONY ,  BOGDANSKI JOSEPH WILLIAM ,  COVI REVIN ROBERT ,  MEYER HERMAN PAUL ,  RAFKIND DANIEL IRA

IPC: G05F1/59 ,  H02H7/20 ,  H02J1/10 ,  H02J9/06 ,  H02M3/28 ,  H02J1/04

公开(公告)号：MX166200B

公开(公告)日：1992-12-23

申请号：MX1363988

申请日：1988-11-01

Applicant: IBM

Inventor： MEYER HERMAN PAUL ,  RAFKIND DANIEL IRA ,  BIAMONTE ROBERT ANTHONY ,  BOGDANSKI JOSEPH WILLIAM ,  COVI KEVIN ROBERT

IPC: G05F1/59 ,  H02H7/20 ,  H02J1/10 ,  H02J9/06 ,  H02M3/28 ,  G05F1/46

公开(公告)号：AU2417888A

公开(公告)日：1989-05-04

申请号：AU2417888

申请日：1988-10-24

Applicant: IBM

Inventor： BIAMONTE ROBERT ANTHONY ,  BOGDANSKI JOSEPH WILLIAM ,  COVI KEVIN ROBERT ,  MEYER HERMAN PAUL ,  RAFKIND DANIEL IRA

IPC: G05F1/59 ,  H02H7/20 ,  H02J1/10 ,  H02J9/06 ,  H02M3/28 ,  H02J13/00 ,  G05F1/575 ,  G05F1/577

公开(公告)号：DE69115799T2

公开(公告)日：1996-07-11

申请号：DE69115799

申请日：1991-06-26

Applicant: IBM

Inventor： MELNICK PAUL JOHN ,  MENNELLA ANTHONY JOSEPH ,  MEYER HERMAN PAUL

IPC: H01L23/02 ,  H01L21/98 ,  H01L23/32 ,  H01L25/07

Abstract: A heat-conductive honeycomb ceramic spacer (11) having an array of apertures therein for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks (13) using a low-profile contact comprising a foil (12) with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet (14). Use of such a foil also allows disconnection of defective stacks in the device which includes extra stacks to compensate therefore, according to an n - x philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.

公开(公告)号：DE3886690T2

公开(公告)日：1994-06-23

申请号：DE3886690

申请日：1988-10-27

Applicant: IBM

Inventor： BIAMONTE ROBERT ANTHONY ,  BOGDANSKI JOSEPH WILLIAM ,  COVI KEVIN ROBERT ,  MEYER HERMAN PAUL ,  RAFKIND DANIEL IRA

IPC: G05F1/59 ,  H02H7/20 ,  H02J1/10 ,  H02J9/06 ,  H02M3/28 ,  H02M3/10

公开(公告)号：DE3886690D1

公开(公告)日：1994-02-10

申请号：DE3886690

申请日：1988-10-27

Applicant: IBM

Inventor： BIAMONTE ROBERT ANTHONY ,  BOGDANSKI JOSEPH WILLIAM ,  COVI KEVIN ROBERT ,  MEYER HERMAN PAUL ,  RAFKIND DANIEL IRA

IPC: G05F1/59 ,  H02H7/20 ,  H02J1/10 ,  H02J9/06 ,  H02M3/28 ,  H02M3/10

公开(公告)号：DE69114622T2

公开(公告)日：1996-06-20

申请号：DE69114622

申请日：1991-08-20

Applicant: IBM

Inventor： GORDON JAMES CARLTON ,  LOVGREN ERIC PAUL ,  MEYER HERMAN PAUL ,  REARICK DONALD PAUL

IPC: H01C1/02 ,  H01C1/08 ,  H01C1/084 ,  H05K7/20

公开(公告)号：DE69115799D1

公开(公告)日：1996-02-08

申请号：DE69115799

申请日：1991-06-26

Applicant: IBM

Inventor： MELNICK PAUL JOHN ,  MENNELLA ANTHONY JOSEPH ,  MEYER HERMAN PAUL

IPC: H01L23/02 ,  H01L21/98 ,  H01L23/32 ,  H01L25/07

Abstract: A heat-conductive honeycomb ceramic spacer (11) having an array of apertures therein for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks (13) using a low-profile contact comprising a foil (12) with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet (14). Use of such a foil also allows disconnection of defective stacks in the device which includes extra stacks to compensate therefore, according to an n - x philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.