公开(公告)号：EP1692530A4

公开(公告)日：2011-01-05

申请号：EP03768917

申请日：2003-11-12

Applicant: IBM

Inventor： CLINE CHRISTOPHER W ,  YARMCHUK EDWARD J ,  ARENA VINCENT A ,  MERTE DONALD A ,  PICUNKO THOMAS ,  WOJSZYNSKI BRIAN J ,  HENDRICKS CHARLES J ,  SCAMA MICHAEL E ,  OLYHA JR ROBERT S ,  HALPERIN ARNOLD

IPC: G01R31/06 ,  G01R19/00 ,  G01R31/02 ,  G01R31/28 ,  G01R31/302 ,  G01R31/305 ,  G03G15/00

CPC classification number: G01R31/2805 ,  G01R19/0061 ,  G01R31/302

公开(公告)号：AU2003291513A1

公开(公告)日：2005-06-29

申请号：AU2003291513

申请日：2003-11-12

Applicant: IBM

Inventor： SCAMA MICHAEL E ,  OLYHA JR ROBERT S ,  HALPERIN ARNOLD ,  CLINE CHRISTOPHER W ,  YARMCHUK EDWARD J ,  ARENA VINCENT A ,  MERTE DONALD A ,  PICUNKO THOMAS ,  WOJSZYNSKI BRIAN J ,  HENDRICKS CHARLES J

IPC: G01R19/00 ,  G01R31/02 ,  G01R31/06 ,  G01R31/305 ,  G03G15/00

Abstract: A method and apparatus for the non-contact electrical test of both opens and shorts in electronic substrates. Top surface electrical test features are exposed to an ionization source under ambient conditions and the subsequent charge build up is measured as a drain current by probes contacting corresponding bottom surface features. Opens are detected by an absence of a drain current and shorts are detected by turning off the ionization source and re-measuring the bottom surface probes with a varying bias applied to each probe in the array.