公开(公告)号：DE3277156D1

公开(公告)日：1987-10-08

申请号：DE3277156

申请日：1982-05-24

Applicant: IBM

Inventor： REISMAN ARNOLD ,  BERKENBLIT MELVIN ,  MERZ CHARLES JOSEPH

IPC: H01L23/42 ,  H01L23/44 ,  H01L23/473

Abstract: A heat dissipating system for cooling circuit chips or modules is described. The system includes circuit chips (30) which are vertically mounted, an inert gas (40) at an elevated pressure being contained within an encased module (20) for providing an enhanced thermal coupling between the chips contained therein, and the walls (22, 26) of the encased module, whereby heat removal from the chips or modules is increased. This enhanced thermal coupling is combined with a reduction in the temperature of the wall (22) of the encased modules so as to reduce the thermal resistance between the surrounding gas and the chips or modules to be cooled, whereby heat removal from the circuit chips or modules is substantially increased. The gas is maintained at a pressure above 240 kPa (35 psi), preferably above 480 kPa (70 psi). Helium is a suitable thermally conducting inert gas.