公开(公告)号：DE69112145D1

公开(公告)日：1995-09-21

申请号：DE69112145

申请日：1991-06-27

Applicant: IBM

Inventor： DIMMICK ROGER FRANCIS ,  KLEVE VERNON JOHN ,  MEYER TIMOTHY LOUIS ,  THOMPSON GARY ALLEN ,  WESTPHAL GORDON WILBUR

IPC: G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  G11B33/12 ,  H05K7/14 ,  H05K7/18 ,  H05K7/20

Abstract: An enclosure for different subsystem variations of a data processing system has a box with front and rear regions separated by an interconnection carrier. The front is divided into standard-size bays for functional modules, while support modules slide into rear bays. A vertical central carrier contains electrical interconnections between the functional and support modules. An environmental module provides cooling air through the enclosure.

公开(公告)号：DE69112145T2

公开(公告)日：1996-05-02

申请号：DE69112145

申请日：1991-06-27

Applicant: IBM

Inventor： DIMMICK ROGER FRANCIS ,  KLEVE VERNON JOHN ,  MEYER TIMOTHY LOUIS ,  THOMPSON GARY ALLEN ,  WESTPHAL GORDON WILBUR

IPC: G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  G11B33/12 ,  H05K7/14 ,  H05K7/18 ,  H05K7/20

Abstract: An enclosure for different subsystem variations of a data processing system has a box with front and rear regions separated by an interconnection carrier. The front is divided into standard-size bays for functional modules, while support modules slide into rear bays. A vertical central carrier contains electrical interconnections between the functional and support modules. An environmental module provides cooling air through the enclosure.