公开(公告)号：CA1078972A

公开(公告)日：1980-06-03

申请号：CA268095

申请日：1976-12-17

Applicant: IBM

Inventor： BOHG ARMIN ,  MIRBACH ERICH ,  EBERT ECKEHARD

IPC: H01L21/306 ,  H01L21/314 ,  H01L21/318 ,  H01L21/72 ,  H01L21/467

Abstract: METHOD OF MAKING A MASKING LAYER The invention relates to a method of making a masking layer for silicon semiconductor bodies, where layers consisting of silicon dioxide and of silicon nitride are arranged one directly above the other on the surface of a semiconductor body.

公开(公告)号：DE69112005T2

公开(公告)日：1996-04-18

申请号：DE69112005

申请日：1991-12-05

Applicant: IBM

Inventor： KAISER LUTZ DIPL ING ,  KIMMERLE EUGEN ,  MIRBACH ERICH ,  NOTTER FRANK DIPL ING

IPC: H01R13/629 ,  H05K7/14

Abstract: The present invention concerns a device for connecting and disconnecting electrical connectors. The device consists of latches (9) which are pivotably arranged in the lower and upper corner regions of a protection housing (6) and a card (3), respectively, and flexible elements (15), in particular springs, which are fixed to an inflexible catch bar (13) or to housing (1) directly. The flexible elements are provided with cams (30). The latches (9) are associated with the flexible elements (15), comprising the cams (30), such that latches (9) are capable of engaging the cams only after an electrical connection has been made. The position of the cams (30) determines the magnitude of the insertion force for the connector. After connection has been establised, the pressure occurring between the connector elements is largely reduced by the flexibly retreating element (15) with the cams (30). As a result, the device according to the invention allows linking connectors with a very large number of contacts, without connector elements and in particular the board or card being damaged by the insertion force.

公开(公告)号：DE69112005D1

公开(公告)日：1995-09-14

申请号：DE69112005

申请日：1991-12-05

Applicant: IBM

Inventor： KAISER LUTZ DIPL ING ,  KIMMERLE EUGEN ,  MIRBACH ERICH ,  NOTTER FRANK DIPL ING

IPC: H01R13/629 ,  H05K7/14

Abstract: The present invention concerns a device for connecting and disconnecting electrical connectors. The device consists of latches (9) which are pivotably arranged in the lower and upper corner regions of a protection housing (6) and a card (3), respectively, and flexible elements (15), in particular springs, which are fixed to an inflexible catch bar (13) or to housing (1) directly. The flexible elements are provided with cams (30). The latches (9) are associated with the flexible elements (15), comprising the cams (30), such that latches (9) are capable of engaging the cams only after an electrical connection has been made. The position of the cams (30) determines the magnitude of the insertion force for the connector. After connection has been establised, the pressure occurring between the connector elements is largely reduced by the flexibly retreating element (15) with the cams (30). As a result, the device according to the invention allows linking connectors with a very large number of contacts, without connector elements and in particular the board or card being damaged by the insertion force.

公开(公告)号：FR2335952A1

公开(公告)日：1977-07-15

申请号：FR7632458

申请日：1976-10-18

Applicant: IBM

Inventor： BOGH ARMIN ,  MIRBACH ERICH ,  EBERT ECKEHARD

IPC: H01L21/314 ,  H01L21/318 ,  H01L21/306

Abstract: A semiconductor dielectric layer formed of silicon nitride having a uniform dispersion of carbon therein for providing reduced intrinsic tensile stresses of less than 10 x 109 dyn/cm2.

公开(公告)号：DE2557079A1

公开(公告)日：1977-06-30

申请号：DE2557079

申请日：1975-12-18

Applicant: IBM DEUTSCHLAND

Inventor： BOHG ARMIN DIPL PHYS ,  MIRBACH ERICH ,  EBERT ECKEHARD

IPC: H01L21/306 ,  H01L21/314 ,  H01L21/318

Abstract: A semiconductor dielectric layer formed of silicon nitride having a uniform dispersion of carbon therein for providing reduced intrinsic tensile stresses of less than 10 x 109 dyn/cm2.