公开(公告)号：EP2342743A4

公开(公告)日：2012-05-16

申请号：EP09819613

申请日：2009-07-21

Applicant: IBM

Inventor： GIGNAC LYNNE M ,  HU CHAO-KUN ,  MITTAL SURBHI ,  YANG CHIH-CHAO

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L23/53238 ,  H01L21/02362 ,  H01L21/76849 ,  H01L21/76865 ,  H01L21/76868 ,  H01L23/5283 ,  H01L23/53223 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：BRPI0914051A2

公开(公告)日：2015-11-03

申请号：BRPI0914051

申请日：2009-07-21

Applicant: IBM

Inventor： HU CHAO-KUN ,  YANG CHIN-CHAO ,  GIGNAC LYNNE M ,  MITTAL SURBHI

IPC: H01L21/70 ,  H01L21/00

公开(公告)号：SG188903A1

公开(公告)日：2013-04-30

申请号：SG2013019146

申请日：2009-07-21

Applicant: IBM

Inventor： GIGNAC LYNNE M ,  HU CHAO-KUN ,  MITTAL SURBHI ,  YANG CHIH-CHAO

Abstract: DISCONTINUOUS/NON-UNIFORM METAL CAP STRUCTURE AND PROCESS FOR INTERCONNECT INTEGRATIONAbstractAn interconnect structure including a noble metal-containing cap that is present at least on some portion of an upper surface of at least one conductive material that is embedded within an interconnect dielectric material is provided. In one embodiment, the noble metal-containing cap is discontinuous, e.g., exists as nuclei or islands on the surface of the at least one conductive material. In another embodiment, the noble metal-containing cap has a non-uniform thickness across the surface of the at least one conductive material.Fig. 4E