公开(公告)号：EP2243155A4

公开(公告)日：2012-07-25

申请号：EP09705024

申请日：2009-01-22

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  EDELSTEIN DANIEL C ,  MCFEELY FENTON R

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L21/76826 ,  H01L21/76849 ,  H01L21/76883 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1875499A4

公开(公告)日：2009-11-04

申请号：EP06749449

申请日：2006-04-07

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  CLEVENGER LAWRENCE A ,  DALTON TIMOTHY J ,  HSU LOUIS C

IPC: H01L21/8242 ,  H01L21/20

CPC classification number: H01L23/5223 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1992012A4

公开(公告)日：2011-08-17

申请号：EP07861255

申请日：2007-03-01

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  SPOONER TERRY A ,  VAN DER STRATEN OSCAR

IPC: H01L21/4763

CPC classification number: H01L21/76831 ,  H01L21/02063 ,  H01L21/31105 ,  H01L21/31144 ,  H01L21/32131 ,  H01L21/76805 ,  H01L21/76808 ,  H01L21/76814 ,  H01L21/76843 ,  H01L21/76844 ,  H01L21/76873 ,  H01L23/5226 ,  H01L23/53238 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1994563A4

公开(公告)日：2011-06-22

申请号：EP07797080

申请日：2007-01-16

Applicant: IBM

Inventor： CLEVENGER LAWRENCE A ,  DALTON TIMOTHY J ,  HSU LOUIS C ,  RADENS CARL ,  WONG KWONG-HON ,  YANG CHIH-CHAO

IPC: H01L27/01 ,  H01L21/8234

CPC classification number: H01L27/1203 ,  H01L21/28114 ,  H01L21/823456 ,  H01L21/84 ,  H01L29/42376 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2140458A4

公开(公告)日：2010-05-05

申请号：EP07867608

申请日：2007-12-04

Applicant: IBM

Inventor： GAIDIS MICHAEL C ,  CLEVENGER LAWRENCE A ,  DALTON TIMOTHY J ,  DEBROSSE JOHN K ,  HSU LOUIS L C ,  RADENS CARL ,  WONG KEITH K H ,  YANG CHIH-CHAO

IPC: G11C19/08 ,  G11B5/008

CPC classification number: G11C19/0841 ,  B82Y10/00 ,  G11C5/02 ,  G11C11/161 ,  G11C11/1675 ,  Y10T29/53165

公开(公告)号：EP2283513A4

公开(公告)日：2012-11-14

申请号：EP08823312

申请日：2008-09-23

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  GIGNAC LYNNE M

IPC: H01L21/02 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L23/53238 ,  H01L21/76846 ,  H01L21/76862 ,  H01L21/76864 ,  H01L2221/1089 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2342743A4

公开(公告)日：2012-05-16

申请号：EP09819613

申请日：2009-07-21

Applicant: IBM

Inventor： GIGNAC LYNNE M ,  HU CHAO-KUN ,  MITTAL SURBHI ,  YANG CHIH-CHAO

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L23/53238 ,  H01L21/02362 ,  H01L21/76849 ,  H01L21/76865 ,  H01L21/76868 ,  H01L23/5283 ,  H01L23/53223 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2095409A4

公开(公告)日：2014-05-21

申请号：EP07842115

申请日：2007-09-10

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  WANG PING-CHUAN ,  WANG YUN-YU

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532

CPC classification number: H01L21/76847 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2020027A4

公开(公告)日：2010-12-01

申请号：EP07870667

申请日：2007-05-11

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  VAN DER STRATEN OSCAR

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L21/76834 ,  H01L21/288 ,  H01L21/76814 ,  H01L21/76816 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76852 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1911096A4

公开(公告)日：2008-10-22

申请号：EP06788341

申请日：2006-07-24

Applicant: IBM

Inventor： DALTON TIMOTHY J ,  HSU LOUIS L C ,  WONG KEITH KWONG HON ,  YANG CHIH-CHAO ,  GAIDIS MICHAEL C ,  RADENS CARL ,  CLEVENGER LAWRENCE A

IPC: H01L27/22 ,  H01L21/768 ,  H01L21/8247 ,  H01L23/528 ,  H01L43/12

CPC classification number: B82Y10/00 ,  H01L27/222 ,  H01L43/12

Abstract: A magnetic random access memory (MRAM) device includes a magnetic tunnel junction (MTJ) stack formed over a lower wiring level, a hardmask formed on the MTJ stack, and an upper wiring level formed over the hardmask. The upper wiring level includes a slot via bitline formed therein, the slot via bitline in contact with the hardmask and in contact with an etch stop layer partially surrounding sidewalls of the hardmask.