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公开(公告)号：DE3375588D1
公开(公告)日：1988-03-10
申请号：DE3375588
申请日：1983-07-04
Applicant: IBM
Inventor： BUPP JAMES RUSSELL , MARKOVICH VOYA , NAPP TRACY ELLEN , SAMBUCETTI CARLOS JUAN
Abstract: A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and or on the surfaces of the substrate.
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