公开(公告)号：JP2002229857A

公开(公告)日：2002-08-16

申请号：JP2001369492

申请日：2001-12-04

Applicant: IBM

Inventor： FARQUHAR DONALD S ,  FEGER CLAUDIUS ,  MARKOVICH VOYA ,  PAPATHOMAS KONSTANTINOS I ,  MARK D PORIKUSU ,  SHAW JANE M ,  SZEPAROWYCZ GEORGE ,  WEINGART STEVE H

IPC: G06F12/14 ,  G06F1/00 ,  G06F21/00 ,  G06F21/06 ,  G06F21/22 ,  H01L23/58 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16

Abstract: PROBLEM TO BE SOLVED: To provide a structure and a method of forming a fraudulent intrusion sensing electronic circuit enclosure including an integrated circuit structure, a mesh structure surrounding the integrated circuit, and a sealing enclosure surrounding the mesh structure. SOLUTION: The mesh structure includes a flexible dielectric layer having a first side and a second side, a screen print pattern of a first flexible conductive circuit line forming a first resistor network on the first side, and a photolithography forming pattern of a second flexible conductive circuit line forming a second resistor network on the second side.

公开(公告)号：DE3375588D1

公开(公告)日：1988-03-10

申请号：DE3375588

申请日：1983-07-04

Applicant: IBM

Inventor： BUPP JAMES RUSSELL ,  MARKOVICH VOYA ,  NAPP TRACY ELLEN ,  SAMBUCETTI CARLOS JUAN

IPC: H05K3/18 ,  C23C18/18 ,  C23C18/20 ,  C23C18/30 ,  H05K3/38

Abstract: A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and or on the surfaces of the substrate.

公开(公告)号：CA1293605C

公开(公告)日：1991-12-31

申请号：CA533598

申请日：1987-04-01

Applicant: IBM

Inventor： AMELIO WILLIAM J ,  MARKOVICH VOYA ,  MCCARTHY WILLIAM J ,  MORING ALLEN F ,  MOSCHAK PETER A ,  STROPE DOUGLAS H

IPC: C08J5/24 ,  B29B13/02 ,  B29B13/06 ,  B29B15/08 ,  B29C70/06 ,  B29C71/00 ,  B29K63/00 ,  B29K105/06 ,  B29L9/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46

Abstract: EN985-039 PROCESS FOR TREATING REINFORCED POLYMER COMPOSITE Reinforced synthetic polymer composite is treated by heating at a temperature and for a time sufficient to obtain a moisture content below that for the relative humidity level at which the composite is to be drilled and/or photoresist exposed; and then subjecting it to conditions to increase the moisture content to that for the relative humidity level of the drilling.

公开(公告)号：DE3570701D1

公开(公告)日：1989-07-06

申请号：DE3570701

申请日：1985-03-07

Applicant: IBM

Inventor： ALPAUGH WARREN ALAN ,  AMELIO WILLIAM JOSEPH ,  MARKOVICH VOYA ,  SAMBUCETTI CARLOS JUAN

IPC: C23C18/40 ,  C23C18/52 ,  H05K3/18

Abstract: @ copper is plated onto a dielectric substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ from each other in at least the cyanide content and oxygen content. The process reduces plating void defects and reduces nodule formation.

公开(公告)号：DE3663151D1

公开(公告)日：1989-06-08

申请号：DE3663151

申请日：1986-02-07

Applicant: IBM

Inventor： AMELIO WILLIAM JOSEPH ,  JUNG DAE YOUNG ,  MARKOVICH VOYA ,  SAMBUCETTI CARLOS JUAN

IPC: H05K3/18 ,  B01J23/00 ,  B01J23/62 ,  C23C18/28 ,  H01B13/00 ,  C23C18/30

Abstract: A concentrate of a palladium-tin colloidal catalyst is obtained by dissolving stannous chloride in HCI, diluting the solution with HCI and then further diluting the solution with deionized water to thereby obtain a diluted stannous chloride solution. This solution is cooled to room temperature or below. A palladium chloride solution is obtained by dissolving palladium chloride in HCI which in tum is also cooled to room temperature or below. The palladium chloride solution is gradually added to the stannous chloride solution and mixed at about room temperature in order to obtain a homogeneous solution. The temperature of the solution is then gradually increased to about 105°C to about 110°C and maintained at that temperature for sufficient time to obtain a homogeneous solution of substantially uniform colloidal particles. The solution of colloidal particles is slowly cooled to about room temperature. The palladium-tin colloidal system is produced reproducibly and is applicable in the manufacturing of highly complex circuitry.

公开(公告)号：DE3463949D1

公开(公告)日：1987-07-02

申请号：DE3463949

申请日：1984-09-21

Applicant: IBM

Inventor： BUPP JAMES R ,  LEMON GARY KEVIN ,  MARKOVICH VOYA ,  SAMBUCETTI CARLOS J ,  TISDALE STEPHEN L ,  TREVITT DONNA J

IPC: H05K3/18 ,  C23C18/28 ,  H05K3/38 ,  C23C18/24 ,  C23C18/38

公开(公告)号：DE3480857D1

公开(公告)日：1990-02-01

申请号：DE3480857

申请日：1984-10-09

Applicant: IBM

Inventor： AMELIO WILLIAM JOSEPH ,  LEMON GARY KEVIN ,  MARKOVICH VOYA ,  PANASIK THEODORE ,  SAMBUCETTI CARLOS JUAN ,  TREVITT DONNA JEAN

IPC: C23C18/16 ,  C23C18/40 ,  C23C18/52 ,  H05K3/18 ,  H05K3/38

Abstract: Multistep process for electroless plating copper onto a non-conductive surface including the steps of 1) laminating a rough copper sheet onto the non-conductive surface; 2) etching away all the copper; 31 conditioning the surface with multifunctional positively charged molecules derived from copolymers of polyacrylamide and functionally active tetraalkylammonium compounds in an diluted inorganic acid; 4) activating the conditioned surface preferably with stannous palladium chloride particles; 5) treating the activated surface with deionized water and diluted HCI; 6) applying a photoresist layer to the surface and selectively exposing and developing the photoresist to produce a mask corresponding to the negative of the desired circuit pattern; and 7) plating copper using successively two baths differing in their oxygen and CN - concentration, where the foregoing steps are interspersed with washing steps.The inventive method is particularly useful to produce copper circuit on substrates of glass, thermoplastics and thermosetting resins, like epoxy cards and boards. If the step 1) is omitted the method is also applicable in reworking substrates having already undergone copper plating and having been rejected due to failures.

公开(公告)号：DE3573139D1

公开(公告)日：1989-10-26

申请号：DE3573139

申请日：1985-05-10

Applicant: IBM

Inventor： AMELIO WILLIAM JOSEPH ,  BARTOLOTTA PETER GERARD ,  MARKOVICH VOYA ,  PARSONS RALPH ELLIOTT

IPC: C23C18/40

公开(公告)号：CA1191745A

公开(公告)日：1985-08-13

申请号：CA428750

申请日：1983-05-24

Applicant: IBM

Inventor： BUPP JAMES R ,  MARKOVICH VOYA ,  NAPP TRACY E ,  SAMBUCETTI CARLOS J

IPC: H05K3/18 ,  C23C18/18 ,  C23C18/20 ,  C23C18/30 ,  H05K3/38

Abstract: CONDITIONING OF A SUBSTRATE FOR ELECTROLESS DIRECT BOND PLATING IN HOLES AND ON SURFACES OF A SUBSTRATE A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and/or on the surfaces of the substrate. The copolymer material contains at least two ionic moieties of a charge opposite from the charge associated with catalyst particles to be subsequently applied prior to the deposition of the conductive metal.

公开(公告)号：DE3775461D1

公开(公告)日：1992-02-06

申请号：DE3775461

申请日：1987-04-03

Applicant: IBM

Inventor： AMELIO WILLIAM JOSEPH ,  MARKOVICH VOYA ,  MCCARTHY WILLIAM JOHN ,  MORING ALLEN FREDERICK ,  MOSCHAK PETER ANDREW ,  STROPE DOUGLAS HOWARD

IPC: C08J5/24 ,  B29B13/02 ,  B29B13/06 ,  B29B15/08 ,  B29C70/06 ,  B29C71/00 ,  B29K63/00 ,  B29K105/06 ,  B29L9/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  G03F7/26

Abstract: Reinforced synthetic polymer composite is treated by heating at a temperature and for a time sufficient to obtain a moisture content below that for the relative humidity level at which the composite is to be drilled and/or photoresist exposed; and then subjecting it to conditions to increase the moisture content to that for the relative humidity level of the drilling.