MICROFLUIDIC PACKAGING
    4.
    发明申请
    MICROFLUIDIC PACKAGING 审中-公开
    微流体包装

    公开(公告)号:WO2005032448A3

    公开(公告)日:2005-12-15

    申请号:PCT/US2004031833

    申请日:2004-09-28

    Abstract: A plate (100) for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which an array of sample cells (110) contain a U -shaped structure having two vertical apertures (121, 123) connected by a horizontal passage (126) in a bottom sheet; reagents are drawn in to the vertical passages by capillary action and react in the horizontal passage. An optional version of the invention includes a relatively large reservoir (680) for containing rinsing fluids.

    Abstract translation: 用于在制药工业中混合和测试材料的板(100)通过以下方法形成,其中,样品池(110)的阵列包含具有两个垂直孔(121,123)的U形结构,所述两个垂直孔通过水平 通道(126)在底部片材中; 试剂通过毛细作用被吸入垂直通道并在水平通道中反应。 本发明的可选形式包括用于容纳冲洗流体的相对较大的容器(680)。

    CERAMIC STRUCTURE AND METHOD FORMING THE SAME

    公开(公告)号:JP2001002475A

    公开(公告)日:2001-01-09

    申请号:JP2000131371

    申请日:2000-04-28

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a new method for producing a semiconductor substrate having a surface metallurgy-feature free from defects as a whole. SOLUTION: Concretely, a ceramic green sheet laminated material, whose surface is protected, is obtained by using at least one surface layer being thermally depolymerized. Further concretely, before laminating, a surface film being thermally depolymerized or decomposed is put on a stack or assembly of the ceramic green sheets and adjusted to fit to the surface form of the green sheets 20 during laminating. Thereafter, the green sheet laminated material 65 having the protected surface can be sized or diced without forming defects. Since the thermally depolymerizable or decomposable film is thermally depolymerized and removed by firing in the sintering process, the film is easily and completely removed and thereby a ceramic substrate having the surface free from defects can be obtained.

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