公开(公告)号：JPS62136638A

公开(公告)日：1987-06-19

申请号：JP25867886

申请日：1986-10-31

Applicant: IBM

Inventor： SACHDEV KRISHNA G ,  KWONG RANEE W ,  KHOJASTEH MAHMOUD M ,  SACHDEV HARBANS S

IPC: G03F7/20 ,  G03F7/039 ,  G03F7/075 ,  H01L21/027

公开(公告)号：JP2005325348A

公开(公告)日：2005-11-24

申请号：JP2005119145

申请日：2005-04-18

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SACHDEV KRISHNA G ,  BERGER DANIEL G ,  CHIOUJONES KELLY M ,  DAVES GLENN G ,  TOY HILTON T

IPC: C09D9/00 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J183/06 ,  H01B1/00 ,  H01B1/22 ,  H01B1/24 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H05K3/32

CPC classification number: H01L24/32 ,  C08K3/08 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K3/321 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a conductive adhesive composition so as to be capable of reuse of parts. SOLUTION: An epoxy based conductive adhesive contains conductive metal filler particles dispersed in a solventless hybrid epoxy polymer matrix and its production method are given. In an additional embodiment, an improved removal method of the cured conductive polymer adhesive disclosed as a thermal interface material from electronic parts for reuse or recovery of reusable parts such as an expensive semiconductor element, a heat sink and other module parts is provided. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供导电粘合剂组合物以便能够重新使用部件。 解决方案：环氧基导电粘合剂包含分散在无溶剂混合环氧聚合物基质中的导电金属填料颗粒，并给出其制备方法。 在另外的实施方案中，提供了一种改进的固化的导电聚合物粘合剂的去除方法，其被公开为用于重新使用或回收诸如昂贵的半导体元件，散热器和其它模块部件的可重复使用部件的电子部件的热界面材料。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2001002475A

公开(公告)日：2001-01-09

申请号：JP2000131371

申请日：2000-04-28

Applicant: IBM

Inventor： NATARAJAN GOVINDARAJAN ,  INDYK RICHARD F ,  VINCENT P PETERSON ,  SACHDEV KRISHNA G

IPC: B28B11/14 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H05K3/46 ,  C04B35/64

Abstract: PROBLEM TO BE SOLVED: To provide a new method for producing a semiconductor substrate having a surface metallurgy-feature free from defects as a whole. SOLUTION: Concretely, a ceramic green sheet laminated material, whose surface is protected, is obtained by using at least one surface layer being thermally depolymerized. Further concretely, before laminating, a surface film being thermally depolymerized or decomposed is put on a stack or assembly of the ceramic green sheets and adjusted to fit to the surface form of the green sheets 20 during laminating. Thereafter, the green sheet laminated material 65 having the protected surface can be sized or diced without forming defects. Since the thermally depolymerizable or decomposable film is thermally depolymerized and removed by firing in the sintering process, the film is easily and completely removed and thereby a ceramic substrate having the surface free from defects can be obtained.

公开(公告)号：JP2009293039A

公开(公告)日：2009-12-17

申请号：JP2009206565

申请日：2009-09-08

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SACHDEV KRISHNA G ,  BERGER DANIEL G ,  CHIOUJONES KELLY M ,  DAVES GLENN G ,  TOY HILTON T

IPC: C09D9/00 ,  C09J5/00 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J183/06 ,  H01B1/00 ,  H01B1/22 ,  H01B1/24 ,  H01L21/56 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H05K3/32

CPC classification number: H01L24/32 ,  C08K3/08 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K3/321 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a thermoconductive adhesive composition for reusing components. SOLUTION: The reworkable thermoconductive adhesive composition comprising an epoxy-based thermoconductive adhesive containing thermoconductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix, and a method of making the composition, are disclosed. In an additional embodiment, an improved method of removing cured thermoconductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components, is provided. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供用于重新使用部件的导热粘合剂组合物。 解决方案：公开了包含分散在无溶剂的杂环氧聚合物基质中的含有导热金属填料颗粒的环氧基导热粘合剂的可再加工的热导粘合剂组合物和制备该组合物的方法。 在另外的实施例中，从用于回收或回收模块组件的可用部件，特别是高成本的半导体器件，散热器和其它模块部件的电子元件中去除固化的导热聚合物粘合剂（这里公开为热界面材料）的改进方法是 提供。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2002134926A

公开(公告)日：2002-05-10

申请号：JP2001193284

申请日：2001-06-26

Applicant: IBM

Inventor： DANIEL GEORGE BERGER ,  FAROOQ SHAJI ,  HERRON LESTER WYNN ,  HUMENIK JAMES N ,  KNICKERBOCKER JOHN ULRICH ,  PASCO ROBERT WILLIAM ,  PERRY CHARLES H ,  SACHDEV KRISHNA G

IPC: G02B6/12 ,  B32B18/00 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H05K1/03 ,  H05K1/05 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide an organic inorganic compound electronic substrate which can be manufactured at a low cost, a compound electronic substrate wherein relative permitivity, impedance, CTE, double refraction and mutual connection stress are low, and package card reliability is high, a compound electronic substrate wherein Tg is high and thermal stability is superior, and a compound electronic substrate having low hygroscopicity. SOLUTION: A compound electronic and/or optical substrate contains polymer material and ceramic material, and has relative permitivity lower than 4 and coefficient of thermal expansion of 8-14 ppm/ deg.C at 100 deg.C. This compound substrate is composed of polymer material containing ceramic filler material or ceramic material containing polymer filler material.

公开(公告)号：CA1221834A

公开(公告)日：1987-05-19

申请号：CA467385

申请日：1984-11-08

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  COHEN MITCHELL S ,  PENNINGTON KEITH S ,  SACHDEV KRISHNA G

IPC: B41M5/24 ,  B41N1/14 ,  G01D15/34

Abstract: SCRATCH RESISTANT RECORDING MATERIALS FOR ELECTROEROSION PRINTING NOT REQUIRING A LUBICANT OVERCOAT Electroerosion recording materials of superior scratch resistance are provided without the need for a lubricant overcoat by incorporating a hard, luricating hydrophobic polymer layer between the support and the removable, thin conductive layer to reduce plastic deformation of the support under stylus writing pressure. The intermediate polymer layer provides a highly adhering surface for the overlying aluminum film and contains graphite fluoride and/or fluorocarbon resins such as TeflonR and hard particles such as silica. The materials may be used in various printing processes including making directly readable images, direct negatives and wear resistant offset printing masters.

公开(公告)号：CA1221831A

公开(公告)日：1987-05-19

申请号：CA465431

申请日：1984-10-15

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  COHEN MITCHELL S ,  PENNINGTON KEITH S ,  SACHDEV KRISHNA G

IPC: B41M5/24 ,  B41N1/14 ,  H05K3/00 ,  H05K3/08 ,  H05K3/28

Abstract: RECORDING MATERIALS OF IMPROVED LUBRICITY FOR USE IN ELECTROEROSION PRINTING Electroerosion recording materials are provided with a surface lubricant film of particulate lubricating nonconductive graphite fluoride and optional conductive materials in a polymeric binder. The lubricating agents reduce stylus scratching of the conductive layer during electroerosion printing, improve contrast, provide a beneficial coating on the writing electrode or stylus and improve the handling and writing characteristics of the recording material. The lubricating agents/polymer films are especially useful (1) where the substrate of the recording material is light transmissive and, after the electroerosion process, the resulting product is suitable for direct-negative applications and (2) where direct offset masters are produced by removal of noneroded lubricant film.

公开(公告)号：CA1233022A

公开(公告)日：1988-02-23

申请号：CA475571

申请日：1985-03-01

Applicant: IBM

Inventor： SACHDEV KRISHNA G ,  SHEAR STEPHEN A ,  PENNINGTON KEITH S ,  COHEN MITCHELL S

IPC: B41M5/24 ,  G03G16/00

Abstract: IMPROVED ELECTROEROSION PRINTING MEDIA USING DEPOLYMERIZABLE POLYMER COATINGS of the Invention Improved electroerosion recording media are described in which ablatable polymers are used in the electroerosion recording medium. This medium includes at least a substrate or support layer, a base layer which protects the substrate, a thin film of conductive material on the base layer and which can be eroded, and a protective overcoat layer. Ablatable polymers are used as binders in either the base layer or the top protective layer, or both, in order to provide advantages during electroerosion. These ablatable polymers undergo thermally induced depolymerization in such a way that the result is the formation of volatile monomeric or low molecular weight species as the predominant products, with little or no adherent residue.

公开(公告)号：CA1221832A

公开(公告)日：1987-05-19

申请号：CA467384

申请日：1984-11-08

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  COHEN MITCHELL S ,  PENNINGTON KEITH S ,  SACHDEV KRISHNA G ,  SHEN JOHN C S

IPC: B41J2/425 ,  B41C1/055 ,  B41C1/10 ,  B41M5/24 ,  B41N1/14 ,  G06K15/00

Abstract: METHOD FOR MAKING DIRECT NEGATIVES AND DIRECT MASTERS BY ELECTRCEROSION RECORDING AND PRODUCTS FORMED THEREBY An electroerosion recording medium for generation of direct negatives or direct masters comprises a conventional support on which is deposited a thin conductive layer, and a protective overlayer comprising a crosslinked binder. The overlayer contains a solid conductive lubricant and optionally a particulate scouring agent to inhibit electrode fouling during writing. Preferably a hard base layer is present between the support and the conductive layer. A method for making the described product is also disclosed.

公开(公告)号：CA1220027A

公开(公告)日：1987-04-07

申请号：CA465437

申请日：1984-10-15

Applicant: IBM

Inventor： COHEN MITCHELL S ,  PENNINGTON KEITH S ,  SACHDEV KRISHNA G ,  WEBER WILLIAM D

IPC: B32B15/12 ,  B41M5/24 ,  B41N1/14 ,  D21H19/00 ,  D21H19/02 ,  D21H19/32

Abstract: YO983-045 IMPROVED ELECTROEROSION RECORDING MATERIAL WITH POLYORGANOSILOXANE OVERLAYER, AND IMPROVED OVERLAYER COMPOSITIONS For high speed electroerosion recording, this invention provides a polyorganosiloxane overlayer which includes high lubricity solid particles as a filler. The overlayer provides a combination lubricant and protective layer for the thin metal layer which is removed by electroerosion to prevent damage for the areas not removed by electroerosion. The polyorganosiloxane overlayer is preferably crosslinked, and is relatively hard, durable, and especially resistant to thermal degradation by the electroerosion arcing. This is important to avoid debris buildup at the recording electrodes resulting from the high temperature arcing for removal of the overlayer in the areas where recording takes place.