公开(公告)号：DE69218327D1

公开(公告)日：1997-04-24

申请号：DE69218327

申请日：1992-08-10

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  KOSBAR LAURA L ,  NEWMAN BERT H ,  POMPEO FRANK L

IPC: C08G59/02 ,  C07D303/24 ,  C08G59/00 ,  C08G59/18 ,  C08G59/22 ,  C08G59/24 ,  C08G59/42 ,  C08G59/50 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C07D303/00 ,  H01L23/16

Abstract: Chips mounted into substrates are often encapsulated with a cured epoxy which is insoluble. The invention herein is the discovery that diepoxides with ketal linkages are soluble. This permits encapsulating chips, testing them for goodness and removing the chips for rework by dissolving the epoxy without destroying the chip or substrate.