公开(公告)号：WO2007149901A2

公开(公告)日：2007-12-27

申请号：PCT/US2007071637

申请日：2007-06-20

Applicant: IBM ,  COFFIN JEFFERY T ,  OSTRANDER STEVEN P ,  POMPEO FRANK L ,  WU JIALI

Inventor： COFFIN JEFFERY T ,  OSTRANDER STEVEN P ,  POMPEO FRANK L ,  WU JIALI

IPC: H01L23/29

CPC classification number: H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) (10) containing a plurality of chips (1 Ia-I Ii) on a substrate (15) which chips are underfilled with a reworkable composition (16) which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross- linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

Abstract translation: 本发明提供了在基板（15）上包含多个芯片（11a-111i）的多芯片陶瓷模块（MCM）（10）的包含芯片的电子器件，其中芯片底部填充有可再加工组合物（16），其允许 一个或多个芯片从设备中取出并更换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分的基质，或优选可固化组分可交联的固化组分的组合，并且当固化形成基体中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

公开(公告)号：JPH113952A

公开(公告)日：1999-01-06

申请号：JP10075098

申请日：1998-04-13

Applicant: IBM

Inventor： EDWARDS DAVID LINN ,  CAMMARANO ARMANDO SALVATORE ,  COFFIN JEFFREY THOMAS ,  COURTNEY MARK GERARD ,  DROFITZ STEPHEN S JR ,  ELLSWORTH MICHAEL JOSEPH JR ,  GOLDMANN LEWIS SIGMUND ,  IRUVANTI SUSHUMNA ,  POMPEO FRANK L ,  SABLINSKI WILLIAM EDWARD ,  SHERIF RAED A ,  TOY HILTON T

IPC: B23K35/14 ,  B23K35/26 ,  H01L21/50 ,  H01L21/60 ,  H01L23/02 ,  H01L23/10

Abstract: PROBLEM TO BE SOLVED: To enable a solder sealed band to apply to an inequality with a large expansion between a cover and a substrate by a method wherein the solder sealed band is formed, by laminating first and second solder interconnect layers and a high-melting point solder core holding the solder core between the first and the second solder interconnect layers. SOLUTION: A solder sealed band is formed into a structure, wherein a first solder interconnect layer 41 is provided on the surface on one side of the surfaces of a high-melting point solder core 43 and at the same time, a second solder interconnect layer 45 is provided on the other surface of the core 43 to make lower the melting point of the layer 41 than that of the layer 45, and, moreover, the melting points of the layers 41 and 45 are made lower than that of the core 43. As a result, the band can apply to an inequality with a large expansion between a cover 20 under use and a substrate 10, it becomes possible to maintain the reliability of a hermetic sealing of the band, and the reprocessable degree of the band and the thermal performance of a package can be modified.

公开(公告)号：JPH10245539A

公开(公告)日：1998-09-14

申请号：JP19831797

申请日：1997-07-24

Applicant: IBM

Inventor： BERGER MICHAEL ,  COICO PATRICK A ,  SACHDEV KRISHNA GANDHI ,  POMPEO FRANK L

IPC: C08L79/08 ,  C08G73/10 ,  C09J179/08 ,  C09J183/10 ,  H01L21/52

Abstract: PROBLEM TO BE SOLVED: To obtain a siloxane-containing polyimide adhesive capable of TSM capping with a reduced seal band width in assembling an electronic package and soluble in a solvent friendly to the environment by using an aromatic diether dianhydride, an aromatic diamine having a flexible molecular chain and a polysiloxanediamine. SOLUTION: The composition for forming the adhesive comprises an aromatic diether dianhydride, an aromatic diamine having a flexible molecular chain and a polysiloxanediamine having a vinyl functional group as part of the structure. The molar ratio of the anhydride to the total diamines is about 0.95/1 to 1.05/1, and an excess molar amount of the reactants are capped with a monohydride or a monoamine compound. This composition is polymerized to obtain a siloxane-containing polyimide adhesive. The seal band width is below 4mm.

公开(公告)号：DE69218327D1

公开(公告)日：1997-04-24

申请号：DE69218327

申请日：1992-08-10

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  KOSBAR LAURA L ,  NEWMAN BERT H ,  POMPEO FRANK L

IPC: C08G59/02 ,  C07D303/24 ,  C08G59/00 ,  C08G59/18 ,  C08G59/22 ,  C08G59/24 ,  C08G59/42 ,  C08G59/50 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C07D303/00 ,  H01L23/16

Abstract: Chips mounted into substrates are often encapsulated with a cured epoxy which is insoluble. The invention herein is the discovery that diepoxides with ketal linkages are soluble. This permits encapsulating chips, testing them for goodness and removing the chips for rework by dissolving the epoxy without destroying the chip or substrate.

公开(公告)号：DE102021125845A1

公开(公告)日：2022-05-19

申请号：DE102021125845

申请日：2021-10-05

Applicant: IBM

Inventor： LEWISON DAVID J ,  BUNT JAY A ,  POMPEO FRANK L ,  OLDREY RICHARD WALTER ,  SYLVESTRI JOHN D ,  TRAN PHONG T

IPC: H01L21/66

Abstract: Ein Verfahren zum Vorbereiten eines Computer-Prozessorchips weist ein Bestimmen der Form einer Durchbiegung des Computer-Prozessorchips bei einer Prüftemperatur auf. Das Verfahren weist außerdem ein selektives Konturieren einer Dicke des Computer-Prozessorchips bei einer Konturierungstemperatur auf, indem physisch Material von einer Oberfläche des Computer-Prozessorchips derart entfernt wird, dass die Oberfläche bei der Prüftemperatur im Wesentlichen eben ist.