Patent search ap:("IBM") AND inv:"NOBLE WANDELL P" Page 1

1.

发明专利
Poly-aluminium exchange for aluminium fill of high aspect 未知

公开(公告)号：SG63784A1

公开(公告)日：1999-03-30

申请号：SG1997004394

申请日：1997-12-10

Applicant: IBM

Inventor： HAKEY MARK C , HORAK DAVID V , LUCE STEPHEN E , MCDEVITT THOMAS L , NOBLE WANDELL P

IPC: H01L21/18 , H01L21/22 , H01L23/48

Patent Agency Ranking