公开(公告)号：JPH09186301A

公开(公告)日：1997-07-15

申请号：JP34589896

申请日：1996-12-25

Applicant: SIEMENS AG ,  IBM

Inventor： BRONNER GARY B ,  HANSCH WILFRIED ,  NOBLE WENDELL P

IPC: H01L27/04 ,  H01L21/334 ,  H01L21/822 ,  H01L21/8242 ,  H01L27/108

Abstract: PROBLEM TO BE SOLVED: To make the formation of buried capacitor electrodes, which can be reconciled with the formation of a large-capacity DRAM, possible at low cost and with a high productivity by a method wherein epitaxial layers, which respectively cover a region containing impurities implanted therein and consist of a semiconductor material, are grown and the impurities are diffused in the epitaxial layers. SOLUTION: As an example, a trench capacitor structure is used as an original boundary of an implantation region 20 and the boundary 48 between buried electrodes attained by diffusion. Trenches 4 respectively end in the buried electrodes and the insulation of the trenches from a substrate is obtained by the boundary between the electrodes lower than those to correspond to the respective valleys of dopant profile valleys. Oxide-nitride-oxide sandwich capacitor dielectric materials 52 are respectively formed in the interiors of the trenches 46. Another connection of a dynamic random access memory device can be formed by a metallization, which can form even conductive terminals of transistors 58 and 58' which are used for controlling an access to a cell.

公开(公告)号：DE3883185D1

公开(公告)日：1993-09-16

申请号：DE3883185

申请日：1988-11-30

Applicant: IBM

Inventor： CRITCHLOW DALE L ,  DEBROSSE JOHN K ,  MOHLER RICK L ,  NOBLE WENDELL P ,  PARRIES PAUL C

IPC: H01L21/28 ,  H01L21/74 ,  H01L21/768 ,  H01L21/822 ,  H01L21/8242 ,  H01L27/04 ,  H01L27/10 ,  H01L27/108 ,  H01L21/82

公开(公告)号：DE3883185T2

公开(公告)日：1994-03-17

申请号：DE3883185

申请日：1988-11-30

Applicant: IBM

Inventor： CRITCHLOW DALE L ,  DEBROSSE JOHN K ,  MOHLER RICK L ,  NOBLE WENDELL P ,  PARRIES PAUL C

IPC: H01L21/28 ,  H01L21/74 ,  H01L21/768 ,  H01L21/822 ,  H01L21/8242 ,  H01L27/04 ,  H01L27/10 ,  H01L27/108 ,  H01L21/82

公开(公告)号：DE69636244T2

公开(公告)日：2007-04-26

申请号：DE69636244

申请日：1996-12-13

Applicant: IBM ,  INFINEON TECHNOLOGIES AG

Inventor： BRONNER GARY B ,  HANSCH WILFRIED ,  NOBLE WENDELL P

IPC: H01L21/8242 ,  H01L27/04 ,  H01L21/334 ,  H01L21/822 ,  H01L27/108

Abstract: A buried plate particularly suitable for formation of a common plate of a plurality of trench capacitors, such as are employed in dynamic random access memories, is formed by implantation of impurities in one or more regions of a wafer or semiconductor layer, epitaxially growing a layer of semiconductor material over the implanted regions and diffusing the implanted impurities into the wafer or semiconductor layer and into the epitaxial layer. Diffusion from such a source avoids process complexity compared with provision of diffusion sources within capacitor trenches and further provides an impurity concentration profile which varies with depth within the resulting body of semiconductor material, resulting in a well-defined boundary of the buried plate and an isolation region both above and below the buried plate. The structure allows biasing of the buried plate as desired, such as for reducing electrical stress on the capacitor dielectric to allow reduction in thickness thereof and reduction of area required for the trench capacitor.

公开(公告)号：DE69636244D1

公开(公告)日：2006-07-27

申请号：DE69636244

申请日：1996-12-13

Applicant: IBM ,  INFINEON TECHNOLOGIES AG

Inventor： BRONNER GARY B ,  HANSCH WILFRIED ,  NOBLE WENDELL P

IPC: H01L21/8242 ,  H01L27/04 ,  H01L21/334 ,  H01L21/822 ,  H01L27/108

Abstract: A buried plate particularly suitable for formation of a common plate of a plurality of trench capacitors, such as are employed in dynamic random access memories, is formed by implantation of impurities in one or more regions of a wafer or semiconductor layer, epitaxially growing a layer of semiconductor material over the implanted regions and diffusing the implanted impurities into the wafer or semiconductor layer and into the epitaxial layer. Diffusion from such a source avoids process complexity compared with provision of diffusion sources within capacitor trenches and further provides an impurity concentration profile which varies with depth within the resulting body of semiconductor material, resulting in a well-defined boundary of the buried plate and an isolation region both above and below the buried plate. The structure allows biasing of the buried plate as desired, such as for reducing electrical stress on the capacitor dielectric to allow reduction in thickness thereof and reduction of area required for the trench capacitor.