公开(公告)号：MY115355A

公开(公告)日：2003-05-31

申请号：MYPI9501097

申请日：1995-04-26

Applicant: IBM

Inventor： NYE HENRY ATKINSON ,  ROEDER JEFFREY FREDERICK ,  TONG HO-MING ,  TOTTA PAUL ANTHONY

IPC: H01L23/48 ,  B23K1/20 ,  H05K3/34 ,  H01L21/60 ,  H01L23/485

Abstract: AN PROCESS AND A STRUCTURE FOR AN IMPROVED SOLDER TERMINAL IS DISCLOSED. THE IMPROVED SOLDER TERMINAL IS MADE OF A BOTTOM METALLIC ADHESION LAYER (80), A CRCU INTERMEDIATE LAYER (85) ON TOP OF THE ADHESION LAYER, A SOLDER BONDING LAYER (90) ABOVE THE CRCU LAYER AND A SOLDER TOP LAYER (120). THE ADHESION LAYER IS EITHER TIW OR TIN. A PROCESS FOR FABRICATING AN IMPROVED TERMINAL METAL CONSISTS OF DEPOSITING AN ADHESIVE METALLIC LAYER, A LAYER OF CRCU OVER THE ADHESIVE LAYER AND A LAYER OF SOLDER BONDING MATERIAL, OVER WHICH A SOLDER LAYER IS FORMED IN SELECTIVE REGIONS AND THE UNDERLYING LAYERS ARE ETCHED USING SOLDER REGIONS AS A MASK.