公开(公告)号：DE69523991T2

公开(公告)日：2002-08-01

申请号：DE69523991

申请日：1995-05-19

Applicant: IBM

Inventor： ATKINSON NYE III ,  ROEDER JEFFREY FREDERICK ,  TONG HO-MING ,  TOTTA PAUL ANTHONY

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L23/482 ,  H01L23/488 ,  H01L23/492 ,  H01L23/498

Abstract: An process and a structure for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask.

公开(公告)号：DE69523991D1

公开(公告)日：2002-01-03

申请号：DE69523991

申请日：1995-05-19

Applicant: IBM

Inventor： ATKINSON NYE III ,  ROEDER JEFFREY FREDERICK ,  TONG HO-MING ,  TOTTA PAUL ANTHONY

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L23/482 ,  H01L23/488 ,  H01L23/492 ,  H01L23/498

Abstract: An process and a structure for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask.

公开(公告)号：ES2165902T3

公开(公告)日：2002-04-01

申请号：ES95480062

申请日：1995-05-19

Applicant: IBM

Inventor： ATKINSON NYE HENRI III ,  ROEDER JEFFREY FREDERICK ,  TONG HO-MING ,  TOTTA PAUL ANTHONY

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L23/532 ,  H01L23/482 ,  H01L23/488 ,  H01L23/492 ,  H01L23/498

Abstract: An process and a structure for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask.

公开(公告)号：AT209397T

公开(公告)日：2001-12-15

申请号：AT95480062

申请日：1995-05-19

Applicant: IBM

Inventor： ATKINSON NYE HENRI III ,  ROEDER JEFFREY FREDERICK ,  TONG HO-MING ,  TOTTA PAUL ANTHONY

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L23/482 ,  H01L23/488 ,  H01L23/492 ,  H01L23/498

Abstract: An process and a structure for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask.

公开(公告)号：BR9502623A

公开(公告)日：1997-08-26

申请号：BR9502623

申请日：1995-05-31

Applicant: IBM

Inventor： NYE HENRY ATKINSON III ,  ROEDER JEFFREY FREDERICK ,  TONG HO-MING ,  TOTTA PAUL ANTHONY

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/485 ,  H01L21/443

Abstract: An process and a structure for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask.

公开(公告)号：MY115355A

公开(公告)日：2003-05-31

申请号：MYPI9501097

申请日：1995-04-26

Applicant: IBM

Inventor： NYE HENRY ATKINSON ,  ROEDER JEFFREY FREDERICK ,  TONG HO-MING ,  TOTTA PAUL ANTHONY

IPC: H01L23/48 ,  B23K1/20 ,  H05K3/34 ,  H01L21/60 ,  H01L23/485

Abstract: AN PROCESS AND A STRUCTURE FOR AN IMPROVED SOLDER TERMINAL IS DISCLOSED. THE IMPROVED SOLDER TERMINAL IS MADE OF A BOTTOM METALLIC ADHESION LAYER (80), A CRCU INTERMEDIATE LAYER (85) ON TOP OF THE ADHESION LAYER, A SOLDER BONDING LAYER (90) ABOVE THE CRCU LAYER AND A SOLDER TOP LAYER (120). THE ADHESION LAYER IS EITHER TIW OR TIN. A PROCESS FOR FABRICATING AN IMPROVED TERMINAL METAL CONSISTS OF DEPOSITING AN ADHESIVE METALLIC LAYER, A LAYER OF CRCU OVER THE ADHESIVE LAYER AND A LAYER OF SOLDER BONDING MATERIAL, OVER WHICH A SOLDER LAYER IS FORMED IN SELECTIVE REGIONS AND THE UNDERLYING LAYERS ARE ETCHED USING SOLDER REGIONS AS A MASK.

公开(公告)号：SG32342A1

公开(公告)日：1996-08-13

申请号：SG1995000346

申请日：1995-04-27

Applicant: IBM

Inventor： NYE HENRY ATKINSON III ,  TONG HO-MING ,  ROEDER JEFFREY FREDERICK ,  TOTTA PAUL ANTHONY

IPC: B23K35/14