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公开(公告)号：DE2324653A1
公开(公告)日：1974-01-03
申请号：DE2324653
申请日：1973-05-16
Applicant: IBM
Inventor： OLSEN JUDITH DIANE , ROMANKIW LUBOMYR TARAS
Abstract: 1422466 Electro-plating fine holes INTERNATIONAL BUSINESS MACHINES CORP 15 March 1973 [9 June 1972] 12475/73 Heading C7B A method of electro-plating the surface of a hole extending through a substrate comprises providing a hole extending through the substrate which hole has a tapering cross-sectional area, and electroplating the hole, e.g. with copper whilst flowing electrolyte therethrough in the direction of decreasing cross-sectional area. Alternatively the hole may taper from both surfaces of the substrate towards the centre thereof; the direction of electrolyte through the hole being periodically reversed. Electro-deposition may be continued to substantially fill the hole with deposited metal. The initial hole may be formed using a laser or electron beam, and optionally forming an etchant through the hole so formed. A non-conductive substrate may be rendered conductive by electroless plating, or by thermal decomposition of an organo-metallic complex. The apparatus shown allows electroplating of holes 2 in substrate 17 positioned as cathode between anodes 16 of Cu or Pt mesh, electrolyte being pumped through inlet/outlet ports 14, 15 either continuously or in alternate directions according to the shape of the holes to be plated. After plating electrolyte may be removed from the hole with compressed air and rinsing with water, alcohol or acetone. The substrate coated may be of alumina or sapphire.
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公开(公告)号：DE3477868D1
公开(公告)日：1989-05-24
申请号：DE3477868
申请日：1984-06-20
Applicant: IBM
Inventor： ACOSTA RAUL EDMUNDO , HORKANS WILMA JEAN , MUKHERJEE RUBY , OLSEN JUDITH DIANE
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