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公开(公告)号：DE68922381D1
公开(公告)日：1995-06-01
申请号：DE68922381
申请日：1989-11-11
Applicant: IBM
Inventor： DEUTSCH ALINA , OPRYSKO MODEST M , RITSKO JOHN J , ROTHMAN LAURA B
IPC: H01L21/66 , G01R31/28 , H01L23/544
Abstract: A thin film region 14 of a multichip carrier 10 is provided with at least one fabrication process or tooling monitor for monitoring the quality of the fabrication process during the sequential formation of the layers of the region 14. The process monitor is formed with a desired layer or layers of the thin film region, such as by a photolithographic process. A centrally disposed active wiring region 30 of a layer is surrounded by peripherally disposed fabrication monitor sites 32. The sites 32 can be located such that they do not occupy or interfere with the surface area required for the wiring region 30 while still being disposed near enough to the wiring region such that the electrical and physical characteristics of the thin film is substantially the same. Four different types of thin film fabrication process monitors are disclosed, including a line/via monitor, a dielectric monitor, a laser assisted repair monitor and a laser assisted engineering change monitor.
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公开(公告)号：DE68922381T2
公开(公告)日：1995-11-23
申请号：DE68922381
申请日：1989-11-11
Applicant: IBM
Inventor： DEUTSCH ALINA , OPRYSKO MODEST M , RITSKO JOHN J , ROTHMAN LAURA B
IPC: H01L21/66 , G01R31/28 , H01L23/544
Abstract: A thin film region 14 of a multichip carrier 10 is provided with at least one fabrication process or tooling monitor for monitoring the quality of the fabrication process during the sequential formation of the layers of the region 14. The process monitor is formed with a desired layer or layers of the thin film region, such as by a photolithographic process. A centrally disposed active wiring region 30 of a layer is surrounded by peripherally disposed fabrication monitor sites 32. The sites 32 can be located such that they do not occupy or interfere with the surface area required for the wiring region 30 while still being disposed near enough to the wiring region such that the electrical and physical characteristics of the thin film is substantially the same. Four different types of thin film fabrication process monitors are disclosed, including a line/via monitor, a dielectric monitor, a laser assisted repair monitor and a laser assisted engineering change monitor.
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公开(公告)号：DE69128258T2
公开(公告)日：1998-05-28
申请号：DE69128258
申请日：1991-05-28
Applicant: IBM
Inventor： BREGMAN MARK F , BREWER WILLIAM D , COHEN MITCHELL S , JOHNSON GLEN W , NOYAN ISMAIL C , OPRYSKO MODEST M , RITTER MARK B , ROGERS DENNIS L , TREWHELLA JEANNINE M
Abstract: A direct optical connector (DOC) comprised of first (201) and second members, each including a plurality of light emitting (202, 204) and light detecting (205, 203) locations, operative in combination with energy transfer media (210) to form direct optical connections between the light emitting locations (202, 204) and the light detecting (203, 205) locations, wherein said first (201) and second members are adapted for reclosable connection to each other whereupon the light emitting locations (202) on one member are aligned with the light detecting locations (205) on the other member. The first (201) and second members of the preferred DOC are modular. Alternative forms of energy transfer media (210) are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc., thereby permitting the fabrication and/or use of a connector most suited to meet the requirements of a particular application. A modular half of a DOC can be used in conjunction with a remote optical connector (ROC) to channel light over relatively long distances. The invention also encompasses processes for fabricating ROCs.
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公开(公告)号：DE69128258D1
公开(公告)日：1998-01-08
申请号：DE69128258
申请日：1991-05-28
Applicant: IBM
Inventor： BREGMAN MARK F , BREWER WILLIAM D , COHEN MITCHELL S , JOHNSON GLEN W , NOYAN ISMAIL C , OPRYSKO MODEST M , RITTER MARK B , ROGERS DENNIS L , TREWHELLA JEANNINE M
Abstract: A direct optical connector (DOC) comprised of first (201) and second members, each including a plurality of light emitting (202, 204) and light detecting (205, 203) locations, operative in combination with energy transfer media (210) to form direct optical connections between the light emitting locations (202, 204) and the light detecting (203, 205) locations, wherein said first (201) and second members are adapted for reclosable connection to each other whereupon the light emitting locations (202) on one member are aligned with the light detecting locations (205) on the other member. The first (201) and second members of the preferred DOC are modular. Alternative forms of energy transfer media (210) are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc., thereby permitting the fabrication and/or use of a connector most suited to meet the requirements of a particular application. A modular half of a DOC can be used in conjunction with a remote optical connector (ROC) to channel light over relatively long distances. The invention also encompasses processes for fabricating ROCs.
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