-
公开(公告)号：JP2001242358A
公开(公告)日：2001-09-07
申请号：JP2001000074
申请日：2001-01-04
Applicant: IBM
Inventor： CHAN BENSON , COHEN MITCHELL S , FORTIER PAUL F , FREITAG LADD W , HALL RICHARD R , JOHNSON GLEN W , LIN HOW TZU , SHERMAN JOHN H
Abstract: PROBLEM TO BE SOLVED: To provide an improved assembly for joining between a horizontal optical fiber cable and a vertical optoelectronic die. SOLUTION: A package is provided in which an optical fiber cable of 12-channel width is joined to a 12-channel vertical resonator type surface emitting laser(VCSEL) transmitter and a multi-channel perpendicularly aligned integrated die(PAID) receiver. According to this package, the height of an assembly package may be lowered by vertically facing a certain die that is parallel to the optical fiber cable and by horizontally facing a certain other die. In this assembly, a vertical optoelectronic die may be vertically connected to a horizontal laminate through a flexible circuit.
-
公开(公告)号：CA2153440A1
公开(公告)日：1996-03-10
申请号：CA2153440
申请日：1995-07-07
Applicant: IBM
Inventor： BRADY MICHAEL J , COFINO THOMAS A , HEINRICH HARLEY K , JOHNSON GLEN W , MOSKOWITZ PAUL A , WALKER GEORGE F
IPC: H01Q1/40 , G01V15/00 , G06K19/077 , H01Q1/22 , H01Q7/00 , H01Q9/16 , H01Q21/26 , H01Q21/28 , H04B1/38 , H04B1/59
Abstract: The invention is a radiofrequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination are sealed with an organic film covering.
-
公开(公告)号：GB2402100B
公开(公告)日：2005-01-19
申请号：GB0417609
申请日：2001-05-03
Applicant: IBM
Inventor： CHAN BENSON , FORTIER PAUL F , GUINDON FRANCOIS M , JOHNSON GLEN W , LETOURNEAU MARTIAL A , SHERMAN JOHN H , TETREAULT REAL
-
公开(公告)号：GB2402100A
公开(公告)日：2004-12-01
申请号：GB0417609
申请日：2001-05-03
Applicant: IBM
Inventor： CHAN BENSON , FORTIER PAUL F , GUINDON FRANCOIS M , JOHNSON GLEN W , LETOURNEAU MARTIAL A , SHERMAN JOHN H , TETREAULT REAL
Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biased to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould (92, Fig 13) is positioned over the base, and resin is then injected into the mould cavity through an inlet comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second subassembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive.
-
公开(公告)号：GB2370012A
公开(公告)日：2002-06-19
申请号：GB0110833
申请日：2001-05-03
Applicant: IBM
Inventor： CHAN BENSON , FORTIER PAUL F , GUINDON FRANCOIS M , JOHNSON GLEN W , LETOURNEAU MARTIAL A , SHERMAN JOHN H , TETREAULT REAL
Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biassed to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould 92 is positioned over the base, and resin is then injected into the mould cavity through an inlet passage 97 and a gate 98. The overmould 18 is part of an optoelectronic transceiver module comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second sub-assembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive. Leads from the sub-assembly 36 are then secured to pads 60,61 in a cavity 58 in the overmould.
-
Patent Agency Ranking
公开(公告)号：DE10065034A1
公开(公告)日：2001-08-09
申请号：DE10065034
申请日：2000-12-23
Applicant: IBM
Inventor： CHAN BENSON , COHEN MITCHELL S , FORTIER PAUL F , FREITAG LADD W , HALL RICHARD R , JOHNSON GLEN W , LIN HOW TZU , SHERMAN JOHN H
Abstract: The module is operatively connected to a host card, and includes a laminate for carrying optoelectronic components, an amplifier chip and a flexible circuit for receiving the amplified electrical signals from the amplifier chip. An optoelectronic chip is electrically connected to the flexible circuit and receives the amplified electrical signals generated by the amplifier chip, and produces optical signals in response. Independent claims are included for an optoelectronic sub-module, a compact module article, a transmitting optoelectric sub-module, an electronic compact sub-module, and a method of coupling a fibre-optical cable to a converter chip.
-
公开(公告)号：DE10065034B4
公开(公告)日：2006-01-19
申请号：DE10065034
申请日：2000-12-23
Applicant: IBM
Inventor： CHAN BENSON , COHEN MITCHELL S , FORTIER PAUL F , FREITAG LADD W , HALL RICHARD R , JOHNSON GLEN W , LIN HOW TZU , SHERMAN JOHN H
Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.
-
公开(公告)号：GB2370012B
公开(公告)日：2004-11-03
申请号：GB0110833
申请日：2001-05-03
Applicant: IBM
Inventor： CHAN BENSON , FORTIER PAUL F , GUINDON FRANCOIS M , JOHNSON GLEN W , LETOURNEAU MARTIAL A , SHERMAN JOHN H , TETREAULT REAL
Abstract: Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.
-
公开(公告)号：DE69128258T2
公开(公告)日：1998-05-28
申请号：DE69128258
申请日：1991-05-28
Applicant: IBM
Inventor： BREGMAN MARK F , BREWER WILLIAM D , COHEN MITCHELL S , JOHNSON GLEN W , NOYAN ISMAIL C , OPRYSKO MODEST M , RITTER MARK B , ROGERS DENNIS L , TREWHELLA JEANNINE M
Abstract: A direct optical connector (DOC) comprised of first (201) and second members, each including a plurality of light emitting (202, 204) and light detecting (205, 203) locations, operative in combination with energy transfer media (210) to form direct optical connections between the light emitting locations (202, 204) and the light detecting (203, 205) locations, wherein said first (201) and second members are adapted for reclosable connection to each other whereupon the light emitting locations (202) on one member are aligned with the light detecting locations (205) on the other member. The first (201) and second members of the preferred DOC are modular. Alternative forms of energy transfer media (210) are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc., thereby permitting the fabrication and/or use of a connector most suited to meet the requirements of a particular application. A modular half of a DOC can be used in conjunction with a remote optical connector (ROC) to channel light over relatively long distances. The invention also encompasses processes for fabricating ROCs.
-
公开(公告)号：DE69128258D1
公开(公告)日：1998-01-08
申请号：DE69128258
申请日：1991-05-28
Applicant: IBM
Inventor： BREGMAN MARK F , BREWER WILLIAM D , COHEN MITCHELL S , JOHNSON GLEN W , NOYAN ISMAIL C , OPRYSKO MODEST M , RITTER MARK B , ROGERS DENNIS L , TREWHELLA JEANNINE M
Abstract: A direct optical connector (DOC) comprised of first (201) and second members, each including a plurality of light emitting (202, 204) and light detecting (205, 203) locations, operative in combination with energy transfer media (210) to form direct optical connections between the light emitting locations (202, 204) and the light detecting (203, 205) locations, wherein said first (201) and second members are adapted for reclosable connection to each other whereupon the light emitting locations (202) on one member are aligned with the light detecting locations (205) on the other member. The first (201) and second members of the preferred DOC are modular. Alternative forms of energy transfer media (210) are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc., thereby permitting the fabrication and/or use of a connector most suited to meet the requirements of a particular application. A modular half of a DOC can be used in conjunction with a remote optical connector (ROC) to channel light over relatively long distances. The invention also encompasses processes for fabricating ROCs.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.017 seconds)
