公开(公告)号：DE2231298A1

公开(公告)日：1973-01-11

申请号：DE2231298

申请日：1972-06-26

Applicant: IBM

Inventor： LO JOHN CHOUNG-LIN ,  ORINIK MICHAEL THEODORE

IPC: C23C18/22 ,  C08G53/20

Abstract: 1329069 Electroless plating INTERNATIONAL BUSINESS MACHINES CORP 17 May 1972 [28 June 1971] 23055/72 Heading C7F Prior to electroless plating with e.g. Ni or Cu, a polyimide substrate is immersed in a quaternary ammonium hydroxide solution, several of which are described, and then in a fluoride solution e.g. potassium or sodium fluorides, or hydrofluoric acid. Electroless baths described are (g/l) (1) copper sulphate pentahydrate 165 to 175, formaldehyde 1880 to 1900 (mil/gal), nickel chloride hexahydrate 63 to 72, NaOH 152 to 162, Rochelle salts 695 to 710, sodium carbonate 68 to 77, and (2) 2 NiCO 3 , 3Ni(OH) 2 4H 2 O 10, HF6, citric acid 5À5, NH 4 HF 2 10, NaH 2 , PO 2 H 2 O 20, NH 4 OH 30, pH 4À5 to 6À8 and temperature 170 to 180‹C. The film may first be given a wet aluminium oxide roughening.

公开(公告)号：DE2231297A1

公开(公告)日：1973-01-11

申请号：DE2231297

申请日：1972-06-26

Applicant: IBM

Inventor： CANESTARO MICHAEL JAMES ,  ORINIK MICHAEL THEODORE

IPC: G03F7/004 ,  H05K1/00 ,  H01B17/62