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    1.
    发明专利
    未知

    公开(公告)号：DE2231298A1

    公开(公告)日：1973-01-11

    申请号：DE2231298

    申请日：1972-06-26

    Applicant: IBM

    Inventor： LO JOHN CHOUNG-LIN ,  ORINIK MICHAEL THEODORE

    IPC: C23C18/22 ,  C08G53/20

    Abstract: 1329069 Electroless plating INTERNATIONAL BUSINESS MACHINES CORP 17 May 1972 [28 June 1971] 23055/72 Heading C7F Prior to electroless plating with e.g. Ni or Cu, a polyimide substrate is immersed in a quaternary ammonium hydroxide solution, several of which are described, and then in a fluoride solution e.g. potassium or sodium fluorides, or hydrofluoric acid. Electroless baths described are (g/l) (1) copper sulphate pentahydrate 165 to 175, formaldehyde 1880 to 1900 (mil/gal), nickel chloride hexahydrate 63 to 72, NaOH 152 to 162, Rochelle salts 695 to 710, sodium carbonate 68 to 77, and (2) 2 NiCO 3 , 3Ni(OH) 2 4H 2 O 10, HF6, citric acid 5À5, NH 4 HF 2 10, NaH 2 , PO 2 H 2 O 20, NH 4 OH 30, pH 4À5 to 6À8 and temperature 170 to 180‹C. The film may first be given a wet aluminium oxide roughening.

    2.
    发明专利
    未知

    公开(公告)号：DE3669951D1

    公开(公告)日：1990-05-03

    申请号：DE3669951

    申请日：1986-01-07

    Applicant: IBM

    Inventor： LO JOHN CHOUNG-LIN ,  LU NENG-HSING

    IPC: H05H1/46 ,  C23F4/00 ,  H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H05K3/00 ,  C23C14/34 ,  C23C16/50

    Abstract: In the system, a hollow electrode (70) having two major surfaces and a plurality of apertures (72) in both major surfaces is disposed in the chamber. Connected to this hollow electrode is a radio frequency power source (76) for generating an electrical field. A second hollow electrode (78) also having two major surfaces with a plurality of apertures in both surfaces is disposed opposite the first electrode (70). A second radio frequency power source (80) is connected to the second electrode. A substrate (74) is placed in the chamber between the first and second electrodes. Provision (94,96,98, 100; 106) is made for introducing a gas to be converted in a reactive species by the radio frequency electrical field so that gas is uniformly distributed across the substrate.

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