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公开(公告)号:DE3171502D1
公开(公告)日:1985-08-29
申请号:DE3171502
申请日:1981-10-27
Applicant: IBM
Inventor: CANESTARO MICHAEL JAMES , FEY EDMOND OTTO
Abstract: A copper foil having at least one nodular surface is contacted with an oxidizing composition for a length of time sufficient to oxidize said nodular surface of said copper foil further to roughen said nodular surface. The oxidizing composition e.g. consists of an aqueous alkaline solution of alkali metal chlorite, said solution containing said chlorite in a concentration of about 2 percent to about 10 percent, and alkali metal hydroxide in a concentration of about 0.3 percent to about 0.7 percent. … The copper foil resulting from the oxidizing treatment is useful as a sacrificial metal layer in producing metal plated substrates by creating an irregular surface on the dielectric substrate employed and it is applicable in the preparation of printed circuits.
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公开(公告)号:DE2459179A1
公开(公告)日:1975-06-26
申请号:DE2459179
申请日:1974-12-14
Applicant: IBM
Inventor: ABOLAFIA OSCAR ROBERT , CANESTARO MICHAEL JAMES , CUTILLO JOSEPH GEORGE , SCHMITT GEORGE PERSHING
IPC: C08F2/50 , C08F299/02 , C08G59/00 , C08G59/40 , C08G59/50 , G03F7/032 , G03F7/038 , H01L21/027 , H05K3/00 , G03C1/68
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公开(公告)号:AT41177T
公开(公告)日:1989-03-15
申请号:AT85106819
申请日:1985-06-03
Applicant: IBM
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公开(公告)号:DE2231297A1
公开(公告)日:1973-01-11
申请号:DE2231297
申请日:1972-06-26
Applicant: IBM
Inventor: CANESTARO MICHAEL JAMES , ORINIK MICHAEL THEODORE
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公开(公告)号:MY116476A
公开(公告)日:2004-02-28
申请号:MYPI9400747
申请日:1994-03-28
Applicant: IBM
Inventor: BARD STEVEN LINDZ , MCCREARY JACK MARLYN , BENDZ GERALD ANDREI , CANESTARO MICHAEL JAMES , CHAPURA JOHN ROBERT , FRANKOSKI EDWARD JAY , HORAN MICHAEL SHAWN , JONES JEFFREY DONALD , KAMPERMAN JAMES STEVEN , KJELGAARD JOHN ROBERT JR
Abstract: A FLUID TREATMENT APPARATUS AND METHOD FOR APPLYING FIRST AND SECOND FLUIDS (E.G., ETCHANT AND WATER) TO AN ARTICLE (E.G., CIRCUIT BOARD) PASSING THROUGH THE APPARATUS AT A PREDETERMINED RATE. THE FIRST FLUID IS IMPINGED ON A SURFACE OF THE ARTICLE AND THEREAFTER COLLECTED WITHIN THE APPARATUS' COMMON HOUSING. THE SECOND FLUID IS IMPINGED ONTO THE SURFACE OF THE ARTICLE AND COLLECTED WITHIN THE SAME HOUSING BUT AT A LOCATION SEPARATE FROM THE COLLECTED FIRST FLUID SO AS TO AT LEAST PARTIALLY PREVENT MIXING THEREOF. THE PREFERRED MEANS FOR EFFECTING FLUID IMPINGEMENT COMPRISES SEPARATE FLUID INJECTORS, EACH INCLUDING AT LEAST TWO ROWS OF FLUID JET INJECTORS THEREIN. THE COLLECTED FLUIDS ARE EACH RETURNED TO THE RESPECTIVE IMPINGEMENT MEANS. REPLENISHMENT OF THE SECOND FLUID IS ACCOMPLISHED USING A PUMP WHICH SUPPLIES THE SECOND FLUID, WHILE THE APPARATUS ALSO INCLUDES MEANS (E. G. , A DRAIN) TO EFFECTIVELY REMOVE THE SECOND FLUID AT A RATE SIMILAR TO THE SUPPLY RATE FOR THE SECOND FLUID. THE FIRST FLUID IS ALSO MAINTAINED AT AN ESTABLISHED LEVEL ABOVE THE ARTICLE'S SURFACE USING SUITABLE MEANS (E.G., DUAL ROLLERS) LOCATED RELATIVE (E.G., ON OPPOSITE SIDES OF) THE FIRST FLUID IMPINGEMENT MEANS. SIMILAR LEVEL RETENTION FOR THE SECOND FLUID IS ALSO POSSIBLE. CASCADING OF THE COLLECTED SECOND FLUID IS ALSO DEFINED, THIS OCCURING WITHIN THE SAME HOUSING CHAMBER WHICH SERVES TO COLLECT THE FIRST FLUID.( FIG 1 )
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公开(公告)号:DE69408490T2
公开(公告)日:1998-09-24
申请号:DE69408490
申请日:1994-03-30
Applicant: IBM
Inventor: BARD STEVEN LINDZ , BENDZ GERALD ANDREI , CANESTARO MICHAEL JAMES , CHAPURA JOHN ROBERT , FRANKOSKI EDWARD JAY , HORAN MICHAEL SHAWN , JONES JEFFREY DONALD , KAMPERMAN JAMES STEVEN , KJELGAARD JOHN ROBERT , MCCREARY JACK MARLYN
Abstract: A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.
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公开(公告)号:DE69408490D1
公开(公告)日:1998-03-19
申请号:DE69408490
申请日:1994-03-30
Applicant: IBM
Inventor: BARD STEVEN LINDZ , BENDZ GERALD ANDREI , CANESTARO MICHAEL JAMES , CHAPURA JOHN ROBERT , FRANKOSKI EDWARD JAY , HORAN MICHAEL SHAWN , JONES JEFFREY DONALD , KAMPERMAN JAMES STEVEN , KJELGAARD JOHN ROBERT , MCCREARY JACK MARLYN
Abstract: A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.
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公开(公告)号:DE3568594D1
公开(公告)日:1989-04-13
申请号:DE3568594
申请日:1985-06-03
Applicant: IBM
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公开(公告)号:DE3371798D1
公开(公告)日:1987-07-02
申请号:DE3371798
申请日:1983-06-23
Applicant: IBM
Inventor: CANESTARO MICHAEL JAMES , MCBRIDE DONALD GENE , WELSH JOHN ANDREW
IPC: C23C18/18 , C23C18/16 , C23C18/38 , C23C18/42 , C25D5/02 , G03F7/11 , H01L21/70 , H05K3/10 , H05K3/24 , H05K3/38 , H01L27/01 , G03F7/02
Abstract: A method of decreasing plated metal defects by applying a layer of a noble metal such as palladium, platinum, gold, iridium, rhodium, or mixtures thereof between a photoresist and a metallic surface.
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