METHOD OF PREPARING A PRINTED CIRCUIT

    公开(公告)号:DE3171502D1

    公开(公告)日:1985-08-29

    申请号:DE3171502

    申请日:1981-10-27

    Applicant: IBM

    Abstract: A copper foil having at least one nodular surface is contacted with an oxidizing composition for a length of time sufficient to oxidize said nodular surface of said copper foil further to roughen said nodular surface. The oxidizing composition e.g. consists of an aqueous alkaline solution of alkali metal chlorite, said solution containing said chlorite in a concentration of about 2 percent to about 10 percent, and alkali metal hydroxide in a concentration of about 0.3 percent to about 0.7 percent. … The copper foil resulting from the oxidizing treatment is useful as a sacrificial metal layer in producing metal plated substrates by creating an irregular surface on the dielectric substrate employed and it is applicable in the preparation of printed circuits.

    FLUID TREATMENT APPARATUS
    5.
    发明专利

    公开(公告)号:MY116476A

    公开(公告)日:2004-02-28

    申请号:MYPI9400747

    申请日:1994-03-28

    Applicant: IBM

    Abstract: A FLUID TREATMENT APPARATUS AND METHOD FOR APPLYING FIRST AND SECOND FLUIDS (E.G., ETCHANT AND WATER) TO AN ARTICLE (E.G., CIRCUIT BOARD) PASSING THROUGH THE APPARATUS AT A PREDETERMINED RATE. THE FIRST FLUID IS IMPINGED ON A SURFACE OF THE ARTICLE AND THEREAFTER COLLECTED WITHIN THE APPARATUS' COMMON HOUSING. THE SECOND FLUID IS IMPINGED ONTO THE SURFACE OF THE ARTICLE AND COLLECTED WITHIN THE SAME HOUSING BUT AT A LOCATION SEPARATE FROM THE COLLECTED FIRST FLUID SO AS TO AT LEAST PARTIALLY PREVENT MIXING THEREOF. THE PREFERRED MEANS FOR EFFECTING FLUID IMPINGEMENT COMPRISES SEPARATE FLUID INJECTORS, EACH INCLUDING AT LEAST TWO ROWS OF FLUID JET INJECTORS THEREIN. THE COLLECTED FLUIDS ARE EACH RETURNED TO THE RESPECTIVE IMPINGEMENT MEANS. REPLENISHMENT OF THE SECOND FLUID IS ACCOMPLISHED USING A PUMP WHICH SUPPLIES THE SECOND FLUID, WHILE THE APPARATUS ALSO INCLUDES MEANS (E. G. , A DRAIN) TO EFFECTIVELY REMOVE THE SECOND FLUID AT A RATE SIMILAR TO THE SUPPLY RATE FOR THE SECOND FLUID. THE FIRST FLUID IS ALSO MAINTAINED AT AN ESTABLISHED LEVEL ABOVE THE ARTICLE'S SURFACE USING SUITABLE MEANS (E.G., DUAL ROLLERS) LOCATED RELATIVE (E.G., ON OPPOSITE SIDES OF) THE FIRST FLUID IMPINGEMENT MEANS. SIMILAR LEVEL RETENTION FOR THE SECOND FLUID IS ALSO POSSIBLE. CASCADING OF THE COLLECTED SECOND FLUID IS ALSO DEFINED, THIS OCCURING WITHIN THE SAME HOUSING CHAMBER WHICH SERVES TO COLLECT THE FIRST FLUID.( FIG 1 )

    6.
    发明专利
    未知

    公开(公告)号:DE69408490T2

    公开(公告)日:1998-09-24

    申请号:DE69408490

    申请日:1994-03-30

    Applicant: IBM

    Abstract: A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.

    7.
    发明专利
    未知

    公开(公告)号:DE69408490D1

    公开(公告)日:1998-03-19

    申请号:DE69408490

    申请日:1994-03-30

    Applicant: IBM

    Abstract: A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.

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