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公开(公告)号：AU2020423563A1
公开(公告)日：2022-06-16
申请号：AU2020423563
申请日：2020-12-14
Applicant: IBM
Inventor： ADIGA VIVEKANANDA , YAN HONGWEN , PAPALIA JOHN , RATH DAVID , PATEL JYOTICA
Abstract: A method for fabricating a bridge structure in a quantum mechanical device includes providing a substructure including a substrate having deposited thereon a layer of a first superconducting material divided into a first portion, a second portion and a third portion that are electrically insulated from each other; depositing a sacrificial layer on the substructure; electrically connecting the first portion and the second portion with a strip of a second superconducting material, the second superconducting material being different from the first superconducting material; and removing a portion of the sacrificial layer so as to form a bridge structure over the third portion between the first portion and the second portion, the bridge structure electrically connecting the first portion to the second portion while not electrically connecting the third portion to the first portion and not electrically connecting the third portion to the second portion.
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