公开(公告)号：GB2504503A

公开(公告)日：2014-02-05

申请号：GB201213579

申请日：2012-07-31

Applicant: IBM ,  EGYPT NANOTECHNOLOGY CT EGNC

Inventor： ESCHER WERNER ,  GOICOCHEA JAVIER V ,  KHALIL AHMED ,  MICHEL BRUNO ,  ONG CHIN LEE ,  PAREDES STEPHEN

IPC: B01D61/36 ,  B01D3/00 ,  B01D5/00 ,  C02F1/04 ,  C02F1/44

Abstract: A desalination system (1) for producing a distillate from a feed liquid comprises: a steam raising device (2) having a liquid section (5) and a steam section (6) which are separated by a membrane system (7); a membrane distillation device (3) having a first steam section (11) and a liquid section (12) which are separated by a wall (14) and having a second steam sec­tion (13) which is separated from the liquid section (12) by a membrane system (15); and a heat exchange device (4) having a first liquid section (21) and a second liquid section (22) , which are separated by a wall (23). The steam raising device (2), the membrane distillation device (3) and the heat exchange de­vice (4) are implemented such that raw liquid fed into the second liquid section (22) of the heat exchanger-boiler device (4) is heated by brine liquid from the liquid section (6) of the steam raising device (2), such that permeate from the steam section (6) of the steam raising device (2) is condensed in the first steam section (11) of the membrane distillation device (3), thereby heating heated feed liquid from the heat exchange device (4). A method for operating a desalination system is also disclosed. Advantageously the desalination system operates at a reduced total thermal energy consumption.

公开(公告)号：GB2512378A

公开(公告)日：2014-10-01

申请号：GB201305730

申请日：2013-03-28

Applicant: IBM

Inventor： DOERING ANDREAS ,  LUIJTEN RONALD PETER ,  MICHEL BRUNO ,  PAREDES STEPHEN

IPC: G06F1/18 ,  G06F1/20 ,  H01R12/70

Abstract: A computer module for cooling electronic components of a printed circuit board (PCB) module and for supplying power to those components is suggested. The computer module 200 comprises a PCB module 101 with electronic components 102 attached, and a cooling module 103 connected thereto, the cooling module being arranged in parallel to the printed circuit board and having a first layer 202 which is both thermally and electrically conductive. The first layer is arranged such that heat can be dissipated from the printed circuit board module and power from a power source can be supplied to the electronic components. This allows improved dissipation of heat along with a power supply. The cooling module may include additional layers 203 to provide further heat dissipation and a ground connection, and the cooling module may be connected 303 to a heat sink 301, 302 to remove the dissipated heat. A modular computer system is disclosed which comprises a plurality of these modules.