公开(公告)号：DE69129851D1

公开(公告)日：1998-08-27

申请号：DE69129851

申请日：1991-09-13

Applicant: IBM

Inventor： HEDDES MARCO ,  LUIJTEN RONALD PETER

IPC: H04L29/06 ,  H04L12/56

Abstract: The present invention relates to a data transmission system and concerns a method for transforming user frames into fixed length cells, e.g. ATM (Asynchronous Transfer Mode), such that the fixed length cells can be transported through a cell handling switch fabric (11). A hardware implementation of this method consists of two parts, a transmitter (12.1) and a receiver (13.1), both being part of a switching subsystem (10) comprising a switch fabric (11). The transmitter (12.1) buffers user data and segments them into fixed length cells to be transported through said switch (11). The receiver part (13.1) reassembles user data on reception of these cells.

公开(公告)号：DE69129851T2

公开(公告)日：1999-03-25

申请号：DE69129851

申请日：1991-09-13

Applicant: IBM

Inventor： HEDDES MARCO ,  LUIJTEN RONALD PETER

IPC: H04L29/06 ,  H04L12/56

Abstract: The present invention relates to a data transmission system and concerns a method for transforming user frames into fixed length cells, e.g. ATM (Asynchronous Transfer Mode), such that the fixed length cells can be transported through a cell handling switch fabric (11). A hardware implementation of this method consists of two parts, a transmitter (12.1) and a receiver (13.1), both being part of a switching subsystem (10) comprising a switch fabric (11). The transmitter (12.1) buffers user data and segments them into fixed length cells to be transported through said switch (11). The receiver part (13.1) reassembles user data on reception of these cells.

公开(公告)号：GB2526565A

公开(公告)日：2015-12-02

申请号：GB201409416

申请日：2014-05-28

Applicant: IBM

Inventor： DOERING CHRISTIAN ,  HELLER RALPH ,  LUIJTEN RONALD PETER ,  SCHMATZ MARTIN LEO

IPC: H05K1/14 ,  H05K5/00 ,  H05K7/02 ,  H05K7/10 ,  H05K7/12

Abstract: A compact assembly 10 of printed circuit boards (PCBs) comprises first and second PCBs 21, 22 maintained parallel and facing each other, each having first and second opposing sides. The second PCB 22 has a first set of side connectors C1 on its first side 221 and a second set of side connectors C2 on its second side 222, each configured for both electrical power supply to and signal communication to and/or from the second PCB. The second PCB is electrically and mechanically connected to the the first PCB via an elastomeric connector 31 located between the first side connectors of the second PCB and the second side 212 of the first PCB and is electrically connected to the first PCB via the second side connectors and a flexible electrical connector 40 which may be a flat flexible cable connecting the second set of side connectors and the first PCB. There may be a second elastomeric connector 32 located between the second set of side connectors C2 and the flexible connector 40. A U shape clamp connector 50 may fasten the assembly by mechanical pressure at a lateral edge of the PCBs. There may be multiple double-sided second PCBs such as mSATA PCBs carrying flash memories 61, 62 located on either side of a first storage module PCB (see Fig. 2).

公开(公告)号：GB2512378A

公开(公告)日：2014-10-01

申请号：GB201305730

申请日：2013-03-28

Applicant: IBM

Inventor： DOERING ANDREAS ,  LUIJTEN RONALD PETER ,  MICHEL BRUNO ,  PAREDES STEPHEN

IPC: G06F1/18 ,  G06F1/20 ,  H01R12/70

Abstract: A computer module for cooling electronic components of a printed circuit board (PCB) module and for supplying power to those components is suggested. The computer module 200 comprises a PCB module 101 with electronic components 102 attached, and a cooling module 103 connected thereto, the cooling module being arranged in parallel to the printed circuit board and having a first layer 202 which is both thermally and electrically conductive. The first layer is arranged such that heat can be dissipated from the printed circuit board module and power from a power source can be supplied to the electronic components. This allows improved dissipation of heat along with a power supply. The cooling module may include additional layers 203 to provide further heat dissipation and a ground connection, and the cooling module may be connected 303 to a heat sink 301, 302 to remove the dissipated heat. A modular computer system is disclosed which comprises a plurality of these modules.